Tinning Fluxes
For cable assembly, good wetting properties and spreading abilities of fluxes used is required to achieve uniformly tinning results.
Ecofrec flux solutions are widly used to achieve great results.
Read moreShowing all 10 results
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Ecofrec™ 205
- Solvent based no-clean liquid flux.
- Wave and selective soldering.
- Excellent wetting and compatible on a broad range of PCB finishing.
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Ecofrec™ 320
- Waterbased VOC free, no-clean liquid flux
- Soldering either with air or nitrogen controlled atmosphere
- High reliability & excellent wetting
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Tailor-made solution
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Ecofrec™ 200
- Solvent based no-clean liquid flux
- Wave & selective soldering
- Excellent wetting & compatible on a broad range of PCB finishing
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Ecofrec™ 303
- Waterbased VOC free, no-clean liquid flux
- Soldering either with air or nitrogen controlled atmosphere
- High reliability
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Ecofrec™ 77
- Waterbased VOC free, no-clean liquid flux
- Lead free tinning process by dipping
- Low residue flux
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Ecofrec™ CMA 155
- Solvent based high rosin liquid flux
- suitable for all fluxing processes
- Very good wetting & easy to clean
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Ecofrec™ DD6
- Solvent based rosin liquid flux
- Wave -, selective spray, foam or manual brush process
- high reliability & easy to clean
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Ecofrec™ 202
- Solvent based no-clean liquid flux
- Soldering either with air or nitrogen controlled atmosphere
- High reliability and no visual residues
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Diluent 1
- Flux thinner for solvent based fluxes.
- Adjust density due to evaporation.
- Made from high purity solvents.
