ECOFREC 303

  • Waterbased VOC free, no-clean liquid flux
  • Soldering either with air or nitrogen controlled atmosphere
  • High reliability
ECOFREC 303

A low residue, no-clean, VOC (Volatile Organic Compound) free flux. Given the high SIR values and it passes the BONO corrosion test it is very suitable for applications in need of high reliability. It is a flux developed for wave soldering through hole, mixed technology, and SMT assemblies. PCB cleaning after soldering is not necessary due to its very low solids content.

 

Benefits

PERFORMANCE

  • Compatible with a wide range of solder mask
  • Compatible with different PCB lead-free finishing as Ni/Au, Sn, Ag, HAL and OSP
  • No microballing
  • Possible to use with leaded and lead-free product

COST

  • Passes Bono test to guarantee a long life time of your product.
  • Avoid possible VOC taxes

HSE

  • No CMR substances
  • VOC free
  • Halogen & amine free
  • Non flammable

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.