Ecofrec™ 205

  • Solvent based no-clean liquid flux
  • Wave & selective soldering
  • Excellent wetting & compatible on a broad range of PCB finishing

ECOFREC 205 is based on our new generation of solder fluxes technology, developed to provide even better wetting properties regardless the selected board finishing. It provides excellent soldering in lead-free as well in leaded and both in wave or in selective wave soldering applications.

 

 

Benefits

PERFORMANCE

  • Excellent wetting & through-hole filling
  • Great performance for Ni/Au, Sn, Ag, HAL and OSP PCB finishes
  • Excellent soldering results – lowest levels of solder-ball formation
  • High SIR values and passes BONO corrosion test

COST

  • Helps to avoid pre-mature failures of your electronic assembly
  • No flux residue cleaning required
  • Highest grade alcohol formula, providing a consistent & reliable process

HSE

  • No CMR substances
  • Free of halide (Fluoride, Chloride, Bromide) and halogen

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.