Semicon Solder Solutions

Specifically developed soldering solutions for semicon processes such as Die Attach, Ball Attach (CSP, BGA), flip chip and waferbumping, POP & SIP.

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Flip Chip & CSP

For Flip Chip applications, solder bumps are deposited on the chip pads at the top side of the wafer during the final wafer processing. To mount the chip, it is flipped over to the PCB matching to the pads and reflowed to complete the interconnection.

CSP – Chip-Scale Packages are smaller than 1.2 times of the die area and are single-die direct mountable packages with typically ball pitch less than 1mm.

Our products are formulated for excellent material compatibility, great wetting properties and are easy-to clean.

Inventec has a wide range of matching cleaning solutions. Check our cleaning section for more details.

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  • Ecorel Free solder paste

    Ecorel™ Free HT 235-16LVD
    • Tin antimony lead free alloy type 6 solder paste
    • No clean smt printing process
    • Excellent low voiding & good wetting
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  • Ecofrec™ POP WS30
    • Water soluble tacky flux
    • PoP and Flip Chip process
    • Excellent wetting properties
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  • Tailor-made solution

    You do not find the perfect product ? We can also offer you some tailor-made solution
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  • Ecofrec™ TF48
    • No clean tacky flux
    • Flip Chip, spheres soldering & components rework
    • Excellent printing & high viscosity
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  • Ecofrec™ TF49
    • No clean tacky flux
    • Flip Chip, spheres soldering & components rework
    • Transparent colorless residue & high viscosity
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Technical support

Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.

Depending on your request, we provide online or onsite support

  • to select the right product based on your specific needs
  • to assist you in your product qualification process
  • to guide you with the initial set up of you process at all your worldwide manufacturing facilities
  • to provide fast response on technical issues which could occur at any time during mass production.
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Technical support
Free-of-Charge cleaning & coating trials

Free-of-Charge cleaning & coating trials

Do you need cleaning or coating after soldering? We provides FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. You want to attend the trials? We are happy to welcome you.

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