Low voiding solder pastes
Voiding in solder joints is a concern in high reliability electronics like automotive, power electronics, LED lighting, etc, as electrical conductivity and thermal dissipation performance are lowered if the percentage and the size of voids are too high. Also voids could reduce the mechanical strength of the joint.
Large area components such as bottom termination components (BTC) and components with bottom thermal plane (DPAK) are particularly critical. So the reduction of voids level and voids size is very important to achieve the expected reliability in such assemblies.
Many factors are responsible of voiding, including the solder paste as voids being partly caused by flux outgassing which remain entrapped in the solder joint. In order to reduce the voids level in an electronic assembly, using a dedicated low voids solder paste is recommended.
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Ecorel™ Free LT140-18
- Sn42Bi57.6Ag0.4 lead free solder paste
- Low temperature SMT printing process
- Halogen free & low voiding
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Ecorel™ 305-16LVD
- SAC305 lead free alloy solder paste
- No clean smt printing process
- Excellent low voiding
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Tailor-made solution
You do not find the perfect product ? We can also offer you some tailor-made solutionContact Us -
Ecorel™ HT 301T
- Pb93,5Sn5Ag1,5 Leaded solder paste
- No clean printing process
- Low voids & high reliability
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Ecorel™ Free 305-31A
- SAC305 lead free solder paste
- No clean SMT printing process
- Excellent low voiding for DCB
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Ecorel™ Free 300-31A
- Tin/Silver lead free solder paste
- No clean SMT printing process
- Excellent low voiding for DCB
