Attachment of silicone chips to the die pad or cavacity of the support structure like leadframes can be achieved using eutectic die attach.
As the presence of voids lowers the shear strength and leads to high die stress that causes cracking, engineered solutions are required to grant highest product reliability.Read more
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Ecorel™ HT 301T
- Pb93,5Sn5Ag1,5 Leaded solder paste
- No clean printing process
- Low voids & high reliability