ECOFREC 200
- Solvent based no-clean liquid flux
- Wave & selective soldering
- Good solder joints without solderballing
ECOFREC 200
Based on our new generation of solder fluxes technology, developed to provide even better wetting properties regardless the selected board finishing.
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PERFORMANCE
- Compatible with a wide range of solder mask
- Compatible with different PCB lead-free finishing as Ni/Au, Sn, Ag, HAL and OSP
- No microballing
- Possible to use with leaded and lead-free product
COST
- Passes Bono test to guarantee a long life time of your product.
HSE
- No CMR substances
- Free of halogen
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.
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ECOFREC DILUENT 1