Ecofrec™ 200

  • Solvent based no-clean liquid flux
  • Soldering either with air or nitrogen controlled atmosphere
  • Good solder joints without solderballing

ECOFREC 200 is based on our new generation of solder fluxes technology, developed to provide even better wetting properties regardless the selected board finishing.

 

Benefits

PERFORMANCE

  • Compatible with a wide range of solder mask
  • Compatible with different PCB lead-free finishing as Ni/Au, Sn, Ag, HAL and OSP
  • No microballing
  • Possible to use with leaded and lead-free product

COST

  • Passes Bono test to guarantee a long life time of your product.

HSE

  • No CMR substances
  • Free of halogen

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.