Soldering

ECOFREC 82

  • Water-based  liquid flux
  • Lead free component tinning process.
  • Easy to clean
ECOFREC 82

A low residue, VOC (Volatile Organic Compound) free flux especially designed for solder component tinning in pure Sn, in SnAgCu or in SnPb. After tinning, residues are easily removed using deionised water. It provides excellent soldering performance.

 

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Benefits

PERFORMANCE

  • Low residue & easy to clean
  • Excellent soldering performance

COST

  • Avoid possible VOC taxes

HSE

  • No CMR substances
  • 100% VOC free
  • Non flammable

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.