Jetting & Dispensing solder pastes
Solder paste dispensing is a very flexible manufacturing process, allowing solder pastes to be put into cavities and on top of mounted components. Furthermore different dot sizes can be achieved within a single process setup.
Solderpaste jetting is optimized on high paste throughput and enables deposition onto flex substrates that stretch, printing with cavities and on top of mounted components during the same process.
Our dedicated jetting & dispense solder pastes offer optimized flow properties and viscosity ranges to achieve best results using these manufacturing processes.Read more