Our dedicated offer of solder pastes for the SMT process, combining different alloys, powder size and flux media for printing, dispensing and assemblies.
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In applications where long-term reliability and safety are paramount, such as life-critical or harsh-environment electronics, advanced SMT solder pastes ensure dependable performance beyond what conventional solutions can achieve…
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Advanced jet printing solder paste and dispensing solder paste solutions optimized for high-performance jet dispensing and dispensing systems, ensuring precision, reliability, and flexibility in modern electronic assembly…
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Low-silver solder pastes and no-silver solder pastes offer high-performance, corrosion-resistant alternatives to traditional silver solder paste, helping manufacturers reduce costs while improving reliability and drop shock resistance in demanding SMT applications…
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Low temperature solder paste is revolutionizing electronics manufacturing by combining energy savings, design flexibility, and enhanced reliability into a cooler, greener, and more efficient alternative to traditional soldering methods…
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Voiding in solder joints is a concern in high reliability electronics like automotive, power electronics, LED lighting, etc, as electrical conductivity and thermal dissipation performance are lowered if the percentage and the size of voids are too high. Also voids could reduce the mechanical strength of the joint.
Large area components such as bottom termination components (BTC) and components with bottom thermal plane (DPAK) are particularly critical. So the reduction of voids level and voids size is very important to achieve the expected reliability in such assemblies.
Many factors are responsible of voiding, including the solder paste as voids being partly caused by flux outgassing which remain entrapped in the solder joint. In order to reduce the voids level in an electronic assembly, using a dedicated low voids solder paste is recommended.
Read moreThe trend toward miniaturization in the field of electronics manufacturing continues with smaller components being placed in even more compact spaces. As a result, the demand for solder pastes containing smaller metal particles is increasing.
All of our recent solder paste products are standardized to powder size Type 4, but we also offer solutions in T5 and T6 to overcome challenges related to ultra-fine pitch electronics manufacturing.
Since the demand for solder pastes with ultra-fine powder size is still relatively low and highly specific, we are further developing products based on the needs and requests of our customers. Please contact us for more details on the availability of powder size related to a specific alloy and in combination with our ECOREL™ flux medium. We are flexible and can develop products according to your specific requirements.
Read morePrinting and soldering results can differ through impacts caused by equipment & equipment settings, stencil qualities, reflow methods and much more.
Our robust assembly solder paste range offers paste solutions optimized for a larger process window, reproducible reflow results and well balanced overall performance.
Read moreECOREL™ water-soluble solder pastes combine optimized wetting properties together with great printing performance.
Remaining flux residues can mostly be cleaned using DI-water, but when better cleaning results are required, we can offer efficient defluxing solutions perfectly matched with our flux formulation and showing great material compatibility.
Besides, SMT-stencils can on average be easily cleaned with DI-water or just with a small amount of cleaning detergent.
Read moreInventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.
Solder paste is a critical material used in the SMT process (Surface Mount Technology), acting as the bonding agent between surface-mounted components and printed circuit boards (PCBs). Modern electronics manufacturing relies heavily on high-performance solder pastes to ensure optimal conductivity, mechanical strength, and reliability. Whether for consumer electronics, automotive control systems, or medical devices, choosing the right solder paste can dramatically affect the efficiency and yield of the SMT production line. Advanced solder pastes are engineered for consistent printing, excellent wetting, and minimal residue, making them essential for today’s high-density and fine-pitch PCB assemblies.
In the SMT process, solder paste is applied to the PCB using stencil printing techniques, followed by precise component placement and reflow soldering. The quality and formulation of the solder paste directly influence reflow profiles, solder joint integrity, and overall process stability. Manufacturers often choose solder pastes based on alloy composition, flux type, and specific application needs—whether leaded or lead-free. As SMT technology continues to evolve, the demand for innovative solder pastes that deliver superior performance, reduced defects, and high reliability is growing rapidly. Optimizing your SMT process with the right solder paste is key to staying competitive in today’s fast-paced electronics market.
In the automotive sector, solder paste quality directly impacts the reliability of electronic control units (ECUs), infotainment systems, and safety-critical components. The SMT process for automotive electronics requires solder pastes capable of withstanding thermal cycling, humidity, and vibration. Low-voiding solder paste options and lead-free alloys are commonly used to meet automotive-grade standards and ensure long-term electrical and mechanical integrity.
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Aerospace and defense applications require solder pastes with unmatched durability, precision, and compliance with stringent military and aerospace regulations. The SMT process for avionics, radar systems, and satellite electronics must use high-purity solder paste to ensure zero-defect soldering in high-altitude and high-stress environments. Specialized solder pastes with high-temperature resistance and excellent print stability are critical for meeting these demanding specifications.
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In the medical electronics field, solder paste performance is essential for ensuring the reliability and safety of diagnostic equipment, implantable devices, and patient monitoring systems. The SMT process in medical device manufacturing prioritizes cleanliness, biocompatibility, and long-term functionality. Using ultra-clean, low-residue solder pastes supports stringent regulatory compliance and contributes to the production of life-saving technology with uncompromised quality.
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