SMT Solder Pastes

Our dedicated offer of solder pastes for the SMT process, combining different alloys, powder size and flux media for printing, dispensing and assemblies.

Solder Paste Solutions
for Every SMT Challenge

Solder paste plays a vital role in the SMT process by ensuring strong electrical and mechanical connections between components and PCBs, with its quality and formulation directly impacting manufacturing efficiency, reliability, and overall product performance.

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High Reliability Solder Paste

Due to the demanding requirements of high-reliability electronics such as long-term durability, chemical and mechanical resilience, and environmental compliance INVENTEC has pioneered advanced solder solutions featuring halogen-free formulations, highly inert flux residues, and robust lead-free alloys tailored for extreme operating conditions.

In applications where long-term reliability and safety are paramount, such as life-critical or harsh-environment electronics, advanced SMT solder pastes ensure dependable performance beyond what conventional solutions can achieve…
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Jet Printing & Dispensing Solder Paste

Jet printing and dispensing solder pastes are essential for precise and flexible SMT manufacturing, and INVENTEC’s specially formulated pastes ensure consistent, high-quality deposits with optimized flow and cleaning properties, compatible with leading equipment like Mycronic, Vermes, Essemtec, and Musashi.

Advanced jet printing solder paste and dispensing solder paste solutions optimized for high-performance jet dispensing and dispensing systems, ensuring precision, reliability, and flexibility in modern electronic assembly…
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Low & No Silver Solder Paste

Low-silver solder pastes and no-silver solder pastes are essential in SMT applications; INVENTEC offers these advanced solutions to help manufacturers reduce material costs, improve solder joint reliability, and minimize the risk of corrosion, all while ensuring consistent, high-quality performance across demanding electronic assembly processes

Low-silver solder pastes and no-silver solder pastes offer high-performance, corrosion-resistant alternatives to traditional silver solder paste, helping manufacturers reduce costs while improving reliability and drop shock resistance in demanding SMT applications…
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Low Temperature Solder Paste

Low temperature solder paste, offered by INVENTEC, plays a crucial role in SMT (Surface Mount Technology) applications by enabling reliable soldering of temperature-sensitive components, minimizing the risk of thermal damage, and supporting more efficient, cost-effective, and sustainable manufacturing processes.

Low temperature solder paste is revolutionizing electronics manufacturing by combining energy savings, design flexibility, and enhanced reliability into a cooler, greener, and more efficient alternative to traditional soldering methods…
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Low Voiding
Solder Paste

Low voiding solder paste plays a key role in SMT (Surface Mount Technology) by minimizing air pockets during reflow, ensuring reliable electrical connections and enhancing the long-term performance and durability of electronic assemblies.

Voiding in solder joints is a concern in high reliability electronics like automotive, power electronics, LED lighting, etc, as electrical conductivity and thermal dissipation performance are lowered if the percentage and the size of voids are too high. Also voids could reduce the mechanical strength of the joint.

Large area components such as bottom termination components (BTC) and components with bottom thermal plane (DPAK) are particularly critical. So the reduction of voids level and voids size is very important to achieve the expected reliability in such assemblies.

Many factors are responsible of voiding, including the solder paste as voids being partly caused by flux outgassing which remain entrapped in the solder joint. In order to reduce the voids level in an electronic assembly, using a dedicated low voids solder paste is recommended.

Miniaturization
Solder Paste Solutions

Miniaturized solder paste solutions are vital in SMT, enabling precise application for smaller components and ensuring reliable, high-quality connections in compact, high-density electronic devices.

The trend toward miniaturization in the field of electronics manufacturing continues with smaller components being placed in even more compact spaces. As a result, the demand for solder pastes containing smaller metal particles is increasing.

All of our recent solder paste products are standardized to powder size Type 4, but we also offer solutions in T5 and T6 to overcome challenges related to ultra-fine pitch electronics manufacturing.

Since the demand for solder pastes with ultra-fine powder size is still relatively low and highly specific, we are further developing products based on the needs and requests of our customers. Please contact us for more details on the availability of powder size related to a specific alloy and in combination with our ECOREL™ flux medium. We are flexible and can develop products according to your specific requirements.

Robust Assembly
Solder Paste

High Volume PCB Assembly Solder Paste plays a critical role in ensuring consistent and reliable solder joints during high-speed surface mount technology (SMT) processes, enabling efficient, precise, and high-quality mass production of electronic devices.

Printing and soldering results can differ through impacts caused by equipment & equipment settings, stencil qualities, reflow methods and much more.

Our robust assembly solder paste range offers paste solutions optimized for a larger process window, reproducible reflow results and well balanced overall performance.

Water-Soluble
Solder Paste

Water-soluble solder paste is necessary in SMT (Surface Mount Technology) applications as it ensures efficient soldering with minimal residue, allowing for easier post-reflow cleaning and improved overall board reliability.

ECOREL™ water-soluble solder pastes combine optimized wetting properties together with great printing performance.

Remaining flux residues can mostly be cleaned using DI-water, but when better cleaning results are required, we can offer efficient defluxing solutions perfectly matched with our flux formulation and showing great material compatibility.

Besides, SMT-stencils can on average be easily cleaned with DI-water or just with a small amount of cleaning detergent.

Technical support

Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.

Depending on your request, we provide online or onsite support

to select the right product based on your specific needs
to assist you in your product qualification process
to guide you with the initial set up of you process at all your worldwide manufacturing facilities
to provide fast response on technical issues which could occur at any time during mass production.

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Free-of-Charge cleaning & coating trials

Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.

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SMT Solder Pastes Guide:
Boosting Performance and Reliability

Solder paste is a critical material used in the SMT process (Surface Mount Technology), acting as the bonding agent between surface-mounted components and printed circuit boards (PCBs). Modern electronics manufacturing relies heavily on high-performance solder pastes to ensure optimal conductivity, mechanical strength, and reliability. Whether for consumer electronics, automotive control systems, or medical devices, choosing the right solder paste can dramatically affect the efficiency and yield of the SMT production line. Advanced solder pastes are engineered for consistent printing, excellent wetting, and minimal residue, making them essential for today’s high-density and fine-pitch PCB assemblies.

In the SMT process, solder paste is applied to the PCB using stencil printing techniques, followed by precise component placement and reflow soldering. The quality and formulation of the solder paste directly influence reflow profiles, solder joint integrity, and overall process stability. Manufacturers often choose solder pastes based on alloy composition, flux type, and specific application needs—whether leaded or lead-free. As SMT technology continues to evolve, the demand for innovative solder pastes that deliver superior performance, reduced defects, and high reliability is growing rapidly. Optimizing your SMT process with the right solder paste is key to staying competitive in today’s fast-paced electronics market.

Automotive SMT Solder Pastes for High-Reliability Applications

In the automotive sector, solder paste quality directly impacts the reliability of electronic control units (ECUs), infotainment systems, and safety-critical components. The SMT process for automotive electronics requires solder pastes capable of withstanding thermal cycling, humidity, and vibration. Low-voiding solder paste options and lead-free alloys are commonly used to meet automotive-grade standards and ensure long-term electrical and mechanical integrity.

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Aerospace and Defense SMT Solder Paste Performance

Aerospace and defense applications require solder pastes with unmatched durability, precision, and compliance with stringent military and aerospace regulations. The SMT process for avionics, radar systems, and satellite electronics must use high-purity solder paste to ensure zero-defect soldering in high-altitude and high-stress environments. Specialized solder pastes with high-temperature resistance and excellent print stability are critical for meeting these demanding specifications.

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Medical SMT Solder Pastes for Precision Electronics

In the medical electronics field, solder paste performance is essential for ensuring the reliability and safety of diagnostic equipment, implantable devices, and patient monitoring systems. The SMT process in medical device manufacturing prioritizes cleanliness, biocompatibility, and long-term functionality. Using ultra-clean, low-residue solder pastes supports stringent regulatory compliance and contributes to the production of life-saving technology with uncompromised quality.

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