Our dedicated offer of solder pastes for the SMT process, combining different alloys, powder size and flux media for printing, dispensing and assemblies.
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Most no-clean flux residues after reflow are chemically inert to only some extend and cleaning or in other words, defluxing is an option still not always desired.
INVENTEC targeted from the early days high reliability applications. We were one of the first companies providing halogen-free formulations and to use BONO test to confirm the reliability of our solder products. This allowed us to fine-tune over those years well balanced solder solutions with highly inert flux residues.
The strength of the solder joint is defined by the mechanical reliability properties of the alloy. Some electronic assemblies have to deal with fast and extreme temperature changes, high temperatures, vibrations or need some resistance to drops. Choosing the right alloys for a particular need is key.
In the past, leaded alloys where the solution to electronic assemblies exposed to extreme temperature changes but due to environmental concerns they have been prohibited to use (with a few exceptions). Lead free alternatives, like SAC405, SAC378 and other variations have been introduced over the years. Inventec’s R&D team is constantly looking for improvements in this field.
Read moreOur jet printing solder pastes are especially designed to work on jet printing equipment and to guarantee continuous and consistent deposits of solder paste.
Although the flux is chemical inert, it is easy to clean with water or solvent based processes. It is optimized to be used on Mycronic, Vermes, Essemtec and Musashi jet printing equipment.
Dispensing solder paste is a very flexible manufacturing process, allowing solder pastes to be put into cavities and on top of mounted components. Furthermore different dot sizes can be achieved within a single process setup.
Our dedicated jet printing & dispensing solder pastes offer optimized flow properties and viscosity ranges to achieve best results using these manufacturing processes.
Read moreLow and No silver solder solutions are often selected to reduce cost but a reduced silver content can also improves substantially the drop shock performance of an electronic assembly.
Typical applications where drop shock is important are consumer electronics and more particular, handheld devices. In recent years however, we see these alloys also used in industries as Automotive & Energy.
The alloy characteristics in combination with the high performance chemistry of the ECOREL™ range provides very good wetting and a robust assembly process for high volume electronics.
Read moreBreakthrough technologies have enabled a wider use of low temperature solder (LTS) processes and in recent years they are used increasingly as an alternative to SAC305 assemblies.
The benefits are not limited to soldering temperature sensitive components as also board to board warpage is significantly reduced, it opens up the possibility for a single pass process and provides more design freedom.
From an environmental & cost perspective, LTC reduces energy use substantially and hence CO2 emissions.
Read moreVoiding in solder joints is a concern in high reliability electronics like automotive, power electronics, LED lighting, etc, as electrical conductivity and thermal dissipation performance are lowered if the percentage and the size of voids are too high. Also voids could reduce the mechanical strength of the joint.
Large area components such as bottom termination components (BTC) and components with bottom thermal plane (DPAK) are particularly critical. So the reduction of voids level and voids size is very important to achieve the expected reliability in such assemblies.
Many factors are responsible of voiding, including the solder paste as voids being partly caused by flux outgassing which remain entrapped in the solder joint. In order to reduce the voids level in an electronic assembly, using a dedicated low voids solder paste is recommended.
Read moreThe trend toward miniaturization in the field of electronics manufacturing continues with smaller components being placed in even more compact spaces. As a result, the demand for solder pastes containing smaller metal particles is increasing.
All of our recent solder paste products are standardized to powder size Type 4, but we also offer solutions in T5 and T6 to overcome challenges related to ultra-fine pitch electronics manufacturing.
Since the demand for solder pastes with ultra-fine powder size is still relatively low and highly specific, we are further developing products based on the needs and requests of our customers. Please contact us for more details on the availability of powder size related to a specific alloy and in combination with our ECOREL™ flux medium. We are flexible and can develop products according to your specific requirements.
Read morePrinting and soldering results can differ through impacts caused by equipment & equipment settings, stencil qualities, reflow methods and much more.
Our robust assembly solder paste range offers paste solutions optimized for a larger process window, reproducible reflow results and well balanced overall performance.
Read moreECOREL™ water-soluble solder pastes combine optimized wetting properties together with great printing performance.
Remaining flux residues can mostly be cleaned using DI-water, but when better cleaning results are required, we can offer efficient defluxing solutions perfectly matched with our flux formulation and showing great material compatibility.
Besides, SMT-stencils can on average be easily cleaned with DI-water or just with a small amount of cleaning detergent.
Read moreInventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.
Solder paste is a critical material used in the SMT process (Surface Mount Technology), acting as the bonding agent between surface-mounted components and printed circuit boards (PCBs). Modern electronics manufacturing relies heavily on high-performance solder pastes to ensure optimal conductivity, mechanical strength, and reliability. Whether for consumer electronics, automotive control systems, or medical devices, choosing the right solder paste can dramatically affect the efficiency and yield of the SMT production line. Advanced solder pastes are engineered for consistent printing, excellent wetting, and minimal residue, making them essential for today’s high-density and fine-pitch PCB assemblies.
In the SMT process, solder paste is applied to the PCB using stencil printing techniques, followed by precise component placement and reflow soldering. The quality and formulation of the solder paste directly influence reflow profiles, solder joint integrity, and overall process stability. Manufacturers often choose solder pastes based on alloy composition, flux type, and specific application needs—whether leaded or lead-free. As SMT technology continues to evolve, the demand for innovative solder pastes that deliver superior performance, reduced defects, and high reliability is growing rapidly. Optimizing your SMT process with the right solder paste is key to staying competitive in today’s fast-paced electronics market.
In the automotive sector, solder paste quality directly impacts the reliability of electronic control units (ECUs), infotainment systems, and safety-critical components. The SMT process for automotive electronics requires solder pastes capable of withstanding thermal cycling, humidity, and vibration. Low-voiding solder paste options and lead-free alloys are commonly used to meet automotive-grade standards and ensure long-term electrical and mechanical integrity.
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Aerospace and defense applications require solder pastes with unmatched durability, precision, and compliance with stringent military and aerospace regulations. The SMT process for avionics, radar systems, and satellite electronics must use high-purity solder paste to ensure zero-defect soldering in high-altitude and high-stress environments. Specialized solder pastes with high-temperature resistance and excellent print stability are critical for meeting these demanding specifications.
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In the medical electronics field, solder paste performance is essential for ensuring the reliability and safety of diagnostic equipment, implantable devices, and patient monitoring systems. The SMT process in medical device manufacturing prioritizes cleanliness, biocompatibility, and long-term functionality. Using ultra-clean, low-residue solder pastes supports stringent regulatory compliance and contributes to the production of life-saving technology with uncompromised quality.
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