Stencil & misprint cleaning
In order to avoid misprints and maintain a reliable production process, stencil cleaning is a standard operation in SMT manufacturing. Although manual cleaning can be used for low volume or prototyping, automatic processes are however recommended for large volume production.
When formulating these products, we have put great attention on fast cleaning cycles to minimize downtime, reducing water consumption and making sure the cleaning agent is not harmful to the cleaning equipment and stencils.
Also under stencil cleaning inside an SMT printer plays an important factor to maintain a reliable and consistent assembly process. For this application it is key the cleaning chemistry doesn`t change the viscosity of the solder paste when it comes in contact with the paste during the under stencil wipe cleaning. Topklean EL 7 is especially developed with this in mind and provide you with a low consumption & safe to use solution.
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Topklean™ EL 606
- Removal of solder paste on stencils & misprinted PCB’s
- Aqeous spray or immersion process
- Fast cleaning with very low HSE impact
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Topklean™ EL 7
- Removal of solder paste on stencils & misprinted PCB’s
- Automated stencil cleaning process inside SMT printer
- High flash point & compatible with most common materials
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Tailor-made solution
You do not find the perfect product ? We can also offer you some tailor-made solutionContact Us -
Topklean™ EL 10F
- Removal of solder paste, uncured adhesives & re-flowed flux residues
- Manual process
- Higher flashpoint vs IPA & low odor
