Pop Assembly
POP assembly is used to combine vertically discrete logic and memory BGA packages to achieve higher component density. The benefits are saving of PCB space and minimizing track length in between inter-operating components.
Showing all 4 results
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Ecorel™ Free HT 235-16LVD
- Tin antimony lead free alloy type 6 solder paste
- No clean smt printing process
- Excellent low voiding & good wetting
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Ecorel™ HT 301T
- Pb93,5Sn5Ag1,5 Leaded solder paste
- No clean printing process
- Low voids & high reliability
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