Miniaturisation Solutions
The trend of further miniaturization within the field of electronics manufacturing continues with smaller components put on even a more reduced space. Therefore the demand for solder pastes with smaller metal particle size is increasing.
All our recent pastes are standard available in type 4 powder size but we offer also solutions in T5 and T6 to overcoming challenges for ultra-fine pitch electronics manufacturing.
As the demand for solder pastes with ultra-fine powder size is still relatively low and very specific we develop more products based on our customer needs and requests. Contact us for more details on the availability of powder size in relation with a specific alloy and in combination with our Ecorel™ flux media. We are flexible to develop based on your specific request.
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ECOREL FREE JP32
- Sac 305 lead free alloy solder paste
- Jet printing process
- Consistent solder paste deposits
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ECOREL EASY SPA-15
- SnPbAg leaded solder paste
- No clean SMT printing process
- Excellent performance for ultrafine-pitch
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Tailor-made solution
You do not find the perfect product ? We can also offer you some tailor-made solutionContact Us
