SIP
System-in-package means a number of integrated circuits are put into chip carrier packages. Dies can be wire-bonded or solder-bumps can be used to join stacked chips together.
As SIP may contain several circuits mounted to the same substrate, a complete functional unit can be built while achieving significant space savings.
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ECOREL FREE 305-31A
- SAC305 lead free solder paste
- No clean SMT printing process
- Excellent low voiding for DCB
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ECOREL FREE 300-31A
- Tin/Silver lead free solder paste
- No clean SMT printing process
- Excellent low voiding for DCB
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