Semicon Solder Solutions

Specifically developed soldering solutions for semicon processes such as Die Attach, Ball Attach (CSP, BGA), flip chip and waferbumping, POP & SIP.

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SIP

System-in-package means a number of integrated circuits are put into chip carrier packages. Dies can be wire-bonded or solder-bumps can be used to join stacked chips together.

As SIP may contain several circuits mounted to the same substrate, a complete functional unit can be built while achieving significant space savings.

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  • Ecorel Free solder paste

    ECOREL FREE 305-31A
    • SAC305 lead free solder paste
    • No clean SMT printing process
    • Excellent low voiding for DCB
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  • Ecorel Free solder paste

    ECOREL FREE 300-31A
    • Tin/Silver lead free solder paste
    • No clean SMT printing process
    • Excellent low voiding for DCB
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  • Tailor-made solution

    You do not find the perfect product ? We can also offer you some tailor-made solution
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Technical support

Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.

Depending on your request, we provide online or onsite support

  • to select the right product based on your specific needs
  • to assist you in your product qualification process
  • to guide you with the initial set up of you process at all your worldwide manufacturing facilities
  • to provide fast response on technical issues which could occur at any time during mass production.
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Technical support
Free-of-Charge cleaning & coating trials

Free-of-Charge cleaning & coating trials

Do you need cleaning or coating after soldering? We provides FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. You want to attend the trials? We are happy to welcome you.

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