Soldering

ECOFREC 77

  • Waterbased no-clean liquid flux
  • Lead free tinning process by dipping
  • Low residue
ECOFREC 77

A low residue, no-clean, VOC (Volatile Organic Compound) free flux especially designed for tinning process with lead free alloys. It provides excellent soldering performance, especially in a dipping process. PCB cleaning after soldering is not necessary due to its very low solids content.

 

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Benefits

PERFORMANCE

  • Low residue, no clean
  • Excellent soldering performance

COST

  • Avoid possible VOC taxes
  • No cleaning required

HSE

  • No CMR substances
  • 100% VOC free
  • Free of halide (Fluoride, Chloride, Bromide) and amine
  • Non flammable

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.