Semicon Solder Solutions

Specifically developed soldering solutions for semicon processes such as Die Attach, Ball Attach (CSP, BGA), flip chip and waferbumping, POP & SIP.

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Ball Attach

POP assembly is used to combine vertically discrete logic and memory BGA packages to achieve higher component density.

The benefits are saving of PCB space and minimizing track length in between interoperating components.

During assembly, the bottom of the POP stack is directly placed on the PCB, the other package is stacked on top. The connection in between the packages and to the PCB is achieved during reflow soldering.

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  • Ecofrec™ TF48
    • No clean tacky flux
    • Flip Chip, spheres soldering & components rework
    • Excellent printing & high viscosity
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  • Ecofrec™ TF49
    • No clean tacky flux
    • Flip Chip, spheres soldering & components rework
    • Transparent colorless residue & high viscosity
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  • Tailor-made solution

    You do not find the perfect product ? We can also offer you some tailor-made solution
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Technical support

Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.

Depending on your request, we provide online or onsite support

  • to select the right product based on your specific needs
  • to assist you in your product qualification process
  • to guide you with the initial set up of you process at all your worldwide manufacturing facilities
  • to provide fast response on technical issues which could occur at any time during mass production.
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Technical support
Free-of-Charge cleaning & coating trials

Free-of-Charge cleaning & coating trials

Do you need cleaning or coating after soldering? We provides FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. You want to attend the trials? We are happy to welcome you.

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