Ecofrec™ POP WS30

  • Water soluble tacky flux
  • PoP and Flip Chip process
  • Excellent wetting properties

ECOFREC™ POP WS30 is a water-soluble tacky flux designed for Package on Package process and Flip Chip process. It is suitable for lead-free and leaded soldering, with or without nitrogen. The rheology and the tackiness of ECOFRECTM POP WS30 are optimized to sufficiently hold packages in place before and during reflow. PCB cleaning is required after soldering with a waterbased process.





  • Application by dipping or dispensing.
  • An excellent solderability with all finishes: Cu-OSP, NiAu, Immersion Sn and Ag
  • Post soldering residues easily cleaned either by pure water or with detergent.


  • Stable process as great reproducible volumes of flux are applied


  • No CMR substances
  • RoHS & REACH compliantn

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.