ECOFREC POP WS30
- Water soluble tacky flux
- PoP and Flip Chip process
- Excellent wetting properties
ECOFREC POP WS30
A water-soluble tacky flux designed for Package on Package process and Flip Chip process. It is suitable for lead-free and leaded soldering, with or without nitrogen. The rheology and the tackiness of ECOFREC POP WS30 are optimized to sufficiently hold packages in place before and during reflow. PCB cleaning is required after soldering with a water-based process.
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PERFORMANCE
- Application by dipping or dispensing.
- An excellent solderability with all finishes: Cu-OSP, NiAu, Immersion Sn and Ag
- Post soldering residues easily cleaned either by pure water or with detergent.
COST
- Stable process as great reproducible volumes of flux are applied
HSE
- No CMR substances
- RoHS & REACH compliantn
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.