Soldering

ECOREL HT 301T

  • Pb93,5Sn5Ag1,5 Leaded solder paste
  • No clean printing process
  • Low voids & high reliability
ECOREL HT 301T

A No-Clean solder paste with high lead content (Pb93,5Sn5Ag1,5), designed for power semiconductors and high temperature assembly of micromodules and embedded systems. Formulated in order to achieve very low levels of voiding, especially for power components (QFN, DPAK, etc.) and to remove easily the flux residues when post reflow cleaning is required.

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Benefits

PERFORMANCE

  • Low void level to improve heat dissipation
  • Very good wetting on NiAu, Ni, NiP, and Cu lead frames
  • Easy-to-clean flux residues

COST

  • Increase lifetime and reliability of your product, hence reduces risk of premature failures.
  • Fast paste-printing speed

HSE

  • No CMR containing substances
  • No Halogen

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.