Ecorel™ Easy 803M

  • Sn63Pb37 leaded solder paste
  • No clean SMT printing process
  • Robust assembly

ECOREL™ EASY 803M range offers a good balance between wettability, printing capability and ability to withstand various thermal profiles. It exhibits high printing speed, excellent abandon time and long steady tackiness.

Lead containing alloys are perfect to withstand constant high temperature fluctuations (-40 to >130 Celcius). However, leaded solder pasted are limited in their use due to the environmental impact of lead. Exceptions are made for Automotive, Aerospace and Defence electronics. Inventec can help you to propose a lead free alternative based on your specific application.

Benefits

PERFORMANCE

  • Excellent printing accuracy and great paste deposit results
  • Very good wetting on all surface finishes, including OSP
  • Transparent colorless residue, even after multiple reflow cycles
  • Withstands high thermal profiles

COST

  • Possibility of extended print-runs to minimizing machine downtime
  • Flux residues can be potentially left on assembly as being non-corrosive

HSE

  • No Halogen
  • No CMR containing substances in flux media.

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.