Ecorel™ Free 305-31A

  • SAC305 lead free solder paste
  • No clean SMT printing process
  • Excellent low voiding for DCB

ECOREL FREE 305-31A  is a no clean halogen-free lead-free solder paste developed with the reliable chemistry of the ECOREL range. It is designed to minimize flux spattering, solder leaking and voiding to achieve consistent bond-line thickness (BLT) between the large chips and the DCB substrate.



  • Low voiding to achieve consistent bond line thickness
  • Very good wetting on copper surfaces
  • Low post-reflow residues


  • Minimized copper oxidation for higher first-pass yield
  • Minimized risks for wire-bonding defects


  • Halogen Free
  • Lead Free
  • No CMR containing substances


The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.