ECOREL FREE 305-31A

  • SAC305 solder paste
  • No clean SMT printing process
  • Excellent low voiding for DCB

ECOREL FREE 305-31A is especially designed to minimize flux spattering, solder leaking and voiding to achieve consistent bond-line thickness (BLT) between the large chips and the DCB substrate. Oxide layer formation on copper surfaces causing color change is efficiently inhibited to achieve a shiny surface with nice surface cosmetics.

The chemistry of this product is also available with other alloys or particle sizes on request.

This is not a product

Although fully in line with safety & environmental regulations, this product doesn`t match our strict criteria to be labelled as a Greenway product.

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GREENWAY ALTERNATIVE

  • We currently don`t have a Greenway alternative but our target is to develop one in the near future. In case you want us to prioritize the development of a Greenway alternative, do not hesitate to contact us.
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Benefits

PERFORMANCE

  • Low voiding to achieve consistent bond line thickness
  • Very good wetting, especially on copper surfaces
  • Low flux spattering & low residue spread

COST

  • Minimized copper oxidation for higher first-pass yield
  • Minimized risks for wire-bonding defects

HSE

  • No halogen
  • Lead Free
  • Free of CMR containing substances

Process recommandation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.