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PROMOSOLV COAT UT10
- Ultra-thin hydrophobic & oleophobic coating
- Dipping & spray process
- Easy & fast process
- Available in different dilutions
- 3M Novec 1700 replacement
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PROMOSOLV DR1
- Solvent for rinsing & spotless fast drying
- Co-solvent & drying process
- Low GWP: 320
- 3M Novec 71IPA replacement
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PROMOSOLV COAT UT10-UV
- Ultra-thin hydrophobic & oleophobic coating with UV tracer
- Dipping & spray process
- Easy & fast process
- Available in different dilutions
- 3M Novec 2704 replacement
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PROMOSOLV 70
- Removal of a wide range of contaminants
- Vapor phase process
- Very low GWP: 96
- 3M Novec 71DE, Novec 72DE, Novec 73DE replacement
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ECOFREC TF48
- No clean tacky flux
- Flip Chip, spheres soldering & components rework
- Excellent printing & high viscosity
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ECOREL FREE 405Y-21
- SAC405 solder paste
- No clean SMT printing process
- Great thermal cycling performance
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CO-SOLVENT CLEANING
EFFICIENT, SAFE AND PRODUCTIVE PROCESS FOR THE ELECTRONICS INDUSTRY.
The co-solvent cleaning process removes organic and mineral residues from solder pastes and solder fluxes in a short cycle time.
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PROMOSOLV NEO A1
- Light oil & particles removal / rinsing & drying
- Vapor phase, co-solvent, flushing & drying process
- No GWP & PFAS free
- 3M Novec 7100 replacement
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PROMOSOLV NEO B1
- Removal of a wide range of contaminants
- Vapor phase process
- PFAS free & no GWP
- 3M Novec 71DE, Novec 72DE, Novec 73DE, and Novec 8200 replacement
