Ecorel™ Free 305-28
- SAC305 lead free solder paste
- No clean SMT printing process
- Robust assembly process
ECOREL FREE 305-28 is especially designed for high volume & complex boards assembly. The paste has a very good pin-in-paste performance within a large process window to achieve flawless, reproducible & stable operation. Furthermore, it shows ideal performance when soldering medium to large boards.
ECOREL FREE 305-28 formulation is also available in other alloys and particle sizes upon request.
- Very good wetting properties to all surface finishes, including OSP
- Robust assembly under a large process window
- Low flux spattering & low residue spread
- Minimizes line-down time & the need for re-work
- Maximizes throughput
- Lead Free
- Free of CMR containing substances