ECOFREC™ POP WS30 是一种水溶性粘性助焊剂,专为封装工艺和倒装芯片工艺而设计。 它适用于无铅和含铅焊接,有或没有氮气。 ECOFRECTM POP WS30 的流变性和粘性经过优化,可以在回流之前和期间充分固定封装。 用水基工艺焊接后需要清洁 PCB。
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IndustrySolutions
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