SMT Solder Pastes

Our dedicated offer of solder pastes for the SMT process, combining different alloys, powder size and flux media for printing, dispensing and assemblies.

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Solder Paste Solutions
for Every SMT Challenge


Solder paste plays a vital role in the SMT process by ensuring strong electrical and mechanical connections between components and PCBs, with its quality and formulation directly impacting manufacturing efficiency, reliability, and overall product performance.

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High Reliability Solder Paste

Due to the demanding requirements of high-reliability electronics such as long-term durability, chemical and mechanical resilience, and environmental compliance INVENTEC has pioneered advanced solder solutions featuring halogen-free formulations, highly inert flux residues, and robust lead-free alloys tailored for extreme operating conditions.

In applications where long-term reliability and safety are paramount, such as life-critical or harsh-environment electronics, advanced SMT solder pastes ensure dependable performance beyond what conventional solutions can achieve…
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Jet Printing & Dispensing Solder Paste

Jet printing and dispensing solder pastes are essential for precise and flexible SMT manufacturing, and INVENTEC’s specially formulated pastes ensure consistent, high-quality deposits with optimized flow and cleaning properties, compatible with leading equipment like Mycronic, Vermes, Essemtec, and Musashi.

Advanced jet printing solder paste and dispensing solder paste solutions optimized for high-performance jet dispensing and dispensing systems, ensuring precision, reliability, and flexibility in modern electronic assembly…
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Low & No Silver Solder Paste

Low-silver solder pastes and no-silver solder pastes are essential in SMT applications; INVENTEC offers these advanced solutions to help manufacturers reduce material costs, improve solder joint reliability, and minimize the risk of corrosion, all while ensuring consistent, high-quality performance across demanding electronic assembly processes.

Low-silver solder pastes and no-silver solder pastes offer high-performance, corrosion-resistant alternatives to traditional silver solder paste, helping manufacturers reduce costs while improving reliability and drop shock resistance in demanding SMT applications…
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Low Temperature Solder Paste

Low temperature solder paste, offered by INVENTEC, plays a crucial role in SMT (Surface Mount Technology) applications by enabling reliable soldering of temperature-sensitive components, minimizing the risk of thermal damage, and supporting more efficient, cost-effective, and sustainable manufacturing processes.

Low temperature solder paste is revolutionizing electronics manufacturing by combining energy savings, design flexibility, and enhanced reliability into a cooler, greener, and more efficient alternative to traditional soldering methods…
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Low Voiding Solder Paste

Low voiding solder paste, such as those developed by INVENTEC, plays a key role in SMT (Surface Mount Technology) by minimizing air pockets during reflow, ensuring reliable electrical connections, and enhancing the long-term performance and durability of electronic assemblies.

To ensure high reliability in applications like automotive, power electronics, and LED lighting, selecting a low voiding solder paste is essential, as it minimizes void formation, enhances thermal and electrical performance, and strengthens solder joint integrity…
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Miniaturization Solder Paste Solutions

Miniaturized solder paste solutions are vital in SMT, with INVENTEC offering advanced formulations that enable precise application for smaller components, ensuring reliable, high-quality connections even in the most compact and high-density electronic devices, meeting the demands of modern technology.

As the electronics industry advances, the demand for high-performance SMT solder paste solutions is rising to meet the challenges of ongoing miniaturization and increasingly compact miniature electronic devices…
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Robust Assembly Solder Paste

High Volume PCB Assembly Solder Paste plays a critical role in ensuring consistent and reliable solder joints during high-speed surface mount technology (SMT) processes, enabling efficient, precise, and high-quality mass production of electronic devices—solutions that INVENTEC proudly delivers with proven expertise.

Discover how our robust SMT solder paste solutions are engineered to enhance process stability, ensure repeatable performance, and maximize production efficiency in demanding high volume PCB assembly environments…
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Water-Soluble Solder Paste

Water-soluble solder paste is necessary in SMT (Surface Mount Technology) applications as it ensures efficient soldering with minimal residue, allowing for easier post-reflow cleaning and improved overall board reliability, with INVENTEC offering advanced solutions to meet these needs.

ECOREL™ water-soluble solder pastes offer high reliability, exceptional wetting properties, and easy cleaning for lead-free soldering and SMT printing, ensuring optimal performance and efficiency in electronic assembly…
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So much more than just a low void paste!


ECOREL Range

ECOREL 305-16LVD

  • Exceptional low voiding
  • Well balanced overal performance
  • Made from recycled metals
  • Room temperature storage*

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*only for T4 powder in jar & cartridge packaging


Interview with Mélanie Mathon
R&D Manager Soldering & Coating

From enhanced performance in fine-pitch applications to environmentally responsible formulations, Mélanie Mathon, R&D Manager Soldering & Coating, discusses how INVENTEC is pushing the boundaries of SMT solder paste development.

Learn how cutting-edge R&D is shaping the future of soldering processes and why selecting the right SMT solder paste is critical for reliability and efficiency in electronics manufacturing.

SMT Solder Pastes – Industrial Soldering Solutions FAQ


Why are SMT solder pastes critical in modern electronics manufacturing?

SMT solder pastes are essential for forming reliable electrical and mechanical connections on printed circuit boards (PCBs). The quality of the paste directly impacts joint strength, conductivity, and long-term reliability of electronic assemblies.

What factors influence the performance of solder pastes?

Key factors include alloy composition, particle size, flux type, storage conditions, and the printing or dispensing process. Correct selection ensures consistent wetting, minimal voids, and high-quality solder joints.

Which types of alloys are commonly used in SMT solder pastes?

Common alloys include SnPb, SAC305, SAC405, and lead-free alternatives. INVENTEC offers tailored solder pastes combining different alloys to match specific thermal profiles, assembly requirements, and regulatory standards.

How does powder particle size affect solder paste printing?

Smaller particle sizes improve stencil printing precision and are ideal for fine-pitch components, while larger particles offer better paste release and reduced oxidation. Choosing the right size optimizes print consistency and assembly yield.

What role does the flux medium play in solder paste performance?

The flux removes oxides during reflow and promotes strong metallurgical bonds. Different flux chemistries (e.g., no-clean, water-soluble, rosin-based) are selected based on cleanliness requirements, solderability, and post-assembly processes.

Can INVENTEC solder pastes support both printing and dispensing applications?

Yes. INVENTEC offers solder pastes optimized for stencil printing, dispensing, and selective soldering, ensuring reliable deposition and uniform joint formation across various SMT assembly lines.

How should solder pastes be stored to maintain performance?

Proper storage at 0–10°C in sealed containers prolongs shelf life. Avoid moisture, prolonged exposure to air, and repeated temperature cycling to maintain flux activity and paste consistency.

What benefits do lead-free solder pastes offer?

Lead-free pastes comply with environmental regulations like RoHS and REACH, providing reliable high-temperature performance, long-term stability, and improved environmental safety without sacrificing solder joint quality.

How can solder paste selection impact assembly reliability?

Choosing the right solder paste alloy, powder size, and flux ensures consistent wetting, minimal void formation, and reduced defects. This directly enhances electrical performance, mechanical strength, and overall product longevity.

How does INVENTEC support customers in SMT solder paste optimization?

INVENTEC provides technical consultation, custom paste formulation, and application support to ensure maximum printability, reflow reliability, and assembly yield across diverse SMT production environments.

See Other Soldering Processes

Comprehensive Guide to SMT Solder Pastes for High-Reliability Electronics


SMT solder pastes are essential materials in surface mount technology, ensuring precise and reliable assembly of printed circuit boards (PCBs). They consist of a mixture of solder alloy powder and flux medium, allowing controlled deposition, excellent wetting, and strong interconnections between components and substrates. Selecting the right solder paste formulation is critical to achieve reliability, thermal stability, and defect-free joints in modern electronics manufacturing.

Key performance factors such as printability, slump resistance, tackiness, voiding control, and reflow profile compatibility determine production yield and long-term reliability. With increasing demands in miniaturization, high-density interconnects, and lead-free regulations, advanced solder pastes play a central role in industries where quality, electrical performance, and thermal management are non-negotiable.


Benefits & Applications

Key BenefitsSMT solder pastes are formulated to provide precise printability, excellent reflow performance, and uniform particle distribution. Advanced solder pastes improve component placement accuracy, reduce voiding, and increase overall assembly reliability in high-density PCB manufacturing.


Technical AspectsSMT solder pastes are engineered for compatibility with a range of stencil printing techniques and reflow profiles. Optimized flux chemistry ensures strong solder joints while maintaining low residue levels. Fine particle size distribution in lead-free solder pastes supports high-precision surface mount assembly and minimizes bridging.


ApplicationsSMT solder pastes are used across automotive electronics, aerospace & defense PCB assemblies, and medical devices where reliability is critical. They ensure optimal electrical connectivity, mechanical integrity, and thermal performance of surface mount components on multilayer boards, supporting strict quality and safety standards.



Automotive SMT Solder Paste

SMT Solder Pastes in the Automotive Industry

In automotive electronics, SMT solder pastes are widely used in the assembly of engine control units (ECUs), advanced driver-assistance systems (ADAS), battery management systems, and power modules for electric vehicles. Their ability to withstand thermal cycling, high vibration, and harsh environments ensures the reliability and safety of modern vehicles.

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Aerospace SMT Solder Paste

SMT Solder Pastes in Aerospace & Defense

For aerospace and defense electronics, SMT solder pastes are critical in manufacturing avionics systems, radar modules, satellite electronics, and communication systems. These applications demand void-free solder joints, high reliability under thermal stress, and compliance with aerospace standards to guarantee mission-critical performance in extreme conditions.

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Medical SMT Solder Paste

SMT Solder Pastes in the Medical Industry

In the medical industry, SMT solder pastes enable the production of reliable printed circuit boards for MRI scanners, X-ray systems, ultrasound devices, and patient monitoring equipment. High-purity formulations are required to minimize residues and ensure biocompatibility while maintaining long-term electrical integrity and signal performance.

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Technical support

Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.

Depending on your request, we provide online or onsite support

  • to select the right product based on your specific needs
  • to assist you in your product qualification process
  • to guide you with the initial set up of you process at all your worldwide manufacturing facilities
  • to provide fast response on technical issues which could occur at any time during mass production.
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Technical support
Free-of-Charge cleaning & coating trials

Free-of-Charge cleaning & coating trials

Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.

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