Our dedicated offer of solder pastes for the SMT process, combining different alloys, powder size and flux media for printing, dispensing and assemblies.
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In applications where long-term reliability and safety are paramount, such as life-critical or harsh-environment electronics, advanced SMT solder pastes ensure dependable performance beyond what conventional solutions can achieve…
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Advanced jet printing solder paste and dispensing solder paste solutions optimized for high-performance jet dispensing and dispensing systems, ensuring precision, reliability, and flexibility in modern electronic assembly…
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Low-silver solder pastes and no-silver solder pastes offer high-performance, corrosion-resistant alternatives to traditional silver solder paste, helping manufacturers reduce costs while improving reliability and drop shock resistance in demanding SMT applications…
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Low temperature solder paste is revolutionizing electronics manufacturing by combining energy savings, design flexibility, and enhanced reliability into a cooler, greener, and more efficient alternative to traditional soldering methods…
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To ensure high reliability in applications like automotive, power electronics, and LED lighting, selecting a low voiding solder paste is essential, as it minimizes void formation, enhances thermal and electrical performance, and strengthens solder joint integrity…
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As the electronics industry advances, the demand for high-performance SMT solder paste solutions is rising to meet the challenges of ongoing miniaturization and increasingly compact miniature electronic devices…
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Discover how our robust SMT solder paste solutions are engineered to enhance process stability, ensure repeatable performance, and maximize production efficiency in demanding high volume PCB assembly environments…
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ECOREL™ water-soluble solder pastes offer high reliability, exceptional wetting properties, and easy cleaning for lead-free soldering and SMT printing, ensuring optimal performance and efficiency in electronic assembly…
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*only for T4 powder in jar & cartridge packaging
From enhanced performance in fine-pitch applications to environmentally responsible formulations, Mélanie Mathon, R&D Manager Soldering & Coating, discusses how INVENTEC is pushing the boundaries of SMT solder paste development.
Learn how cutting-edge R&D is shaping the future of soldering processes and why selecting the right SMT solder paste is critical for reliability and efficiency in electronics manufacturing.
SMT solder pastes are essential for forming reliable electrical and mechanical connections on printed circuit boards (PCBs). The quality of the paste directly impacts joint strength, conductivity, and long-term reliability of electronic assemblies.
Key factors include alloy composition, particle size, flux type, storage conditions, and the printing or dispensing process. Correct selection ensures consistent wetting, minimal voids, and high-quality solder joints.
Common alloys include SnPb, SAC305, SAC405, and lead-free alternatives. INVENTEC offers tailored solder pastes combining different alloys to match specific thermal profiles, assembly requirements, and regulatory standards.
Smaller particle sizes improve stencil printing precision and are ideal for fine-pitch components, while larger particles offer better paste release and reduced oxidation. Choosing the right size optimizes print consistency and assembly yield.
The flux removes oxides during reflow and promotes strong metallurgical bonds. Different flux chemistries (e.g., no-clean, water-soluble, rosin-based) are selected based on cleanliness requirements, solderability, and post-assembly processes.
Yes. INVENTEC offers solder pastes optimized for stencil printing, dispensing, and selective soldering, ensuring reliable deposition and uniform joint formation across various SMT assembly lines.
Proper storage at 0–10°C in sealed containers prolongs shelf life. Avoid moisture, prolonged exposure to air, and repeated temperature cycling to maintain flux activity and paste consistency.
Lead-free pastes comply with environmental regulations like RoHS and REACH, providing reliable high-temperature performance, long-term stability, and improved environmental safety without sacrificing solder joint quality.
Choosing the right solder paste alloy, powder size, and flux ensures consistent wetting, minimal void formation, and reduced defects. This directly enhances electrical performance, mechanical strength, and overall product longevity.
INVENTEC provides technical consultation, custom paste formulation, and application support to ensure maximum printability, reflow reliability, and assembly yield across diverse SMT production environments.
SMT solder pastes are essential materials in surface mount technology, ensuring precise and reliable assembly of printed circuit boards (PCBs). They consist of a mixture of solder alloy powder and flux medium, allowing controlled deposition, excellent wetting, and strong interconnections between components and substrates. Selecting the right solder paste formulation is critical to achieve reliability, thermal stability, and defect-free joints in modern electronics manufacturing.
Key performance factors such as printability, slump resistance, tackiness, voiding control, and reflow profile compatibility determine production yield and long-term reliability. With increasing demands in miniaturization, high-density interconnects, and lead-free regulations, advanced solder pastes play a central role in industries where quality, electrical performance, and thermal management are non-negotiable.
Key BenefitsSMT solder pastes are formulated to provide precise printability, excellent reflow performance, and uniform particle distribution. Advanced solder pastes improve component placement accuracy, reduce voiding, and increase overall assembly reliability in high-density PCB manufacturing.
Technical AspectsSMT solder pastes are engineered for compatibility with a range of stencil printing techniques and reflow profiles. Optimized flux chemistry ensures strong solder joints while maintaining low residue levels. Fine particle size distribution in lead-free solder pastes supports high-precision surface mount assembly and minimizes bridging.
ApplicationsSMT solder pastes are used across automotive electronics, aerospace & defense PCB assemblies, and medical devices where reliability is critical. They ensure optimal electrical connectivity, mechanical integrity, and thermal performance of surface mount components on multilayer boards, supporting strict quality and safety standards.
In automotive electronics, SMT solder pastes are widely used in the assembly of engine control units (ECUs), advanced driver-assistance systems (ADAS), battery management systems, and power modules for electric vehicles. Their ability to withstand thermal cycling, high vibration, and harsh environments ensures the reliability and safety of modern vehicles.
For aerospace and defense electronics, SMT solder pastes are critical in manufacturing avionics systems, radar modules, satellite electronics, and communication systems. These applications demand void-free solder joints, high reliability under thermal stress, and compliance with aerospace standards to guarantee mission-critical performance in extreme conditions.
In the medical industry, SMT solder pastes enable the production of reliable printed circuit boards for MRI scanners, X-ray systems, ultrasound devices, and patient monitoring equipment. High-purity formulations are required to minimize residues and ensure biocompatibility while maintaining long-term electrical integrity and signal performance.
Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.