Cleaning power electronics is essential for maintaining their performance and extending their lifespan. Over time, dust, dirt, and other contaminants can accumulate on the surfaces of power electronics, especially on components like circuit boards, connectors, and heat sinks. This buildup can lead to poor heat dissipation, which may cause components to overheat and malfunction. By regularly cleaning these components, you ensure that they continue to operate at peak efficiency, reducing the risk of thermal damage and electrical short circuits.

In addition to improving performance, cleaning power electronics helps prevent costly repairs or replacements. Contaminants can also affect the electrical connections, leading to intermittent faults or complete failure. INVENTEC offers advanced cleaning solutions and products specifically designed for power electronics, helping to remove contaminants without damaging sensitive components. Their solutions enhance the longevity, reliability, and overall efficiency of power electronic systems, ensuring reliable operation in critical applications, such as renewable energy systems, industrial machinery, and telecommunications.

Regular cleaning with INVENTEC products thus helps maintain the high performance of power electronics while reducing maintenance costs.

In semiconductor manufacturing, effective package cleaning is a critical process to ensure the optimal performance and reliability of devices like BGAs, CMOS and flip chips. Contaminants such as particles, flux residues, and other impurities can negatively impact electrical performance and overall device yield. Therefore, removing these contaminants during the final stages of production is essential to maintaining high standards of quality and functionality.

INVENTEC offers a comprehensive range of cleaning solutions designed to address these challenges. Their portfolio includes both water-based and solvent-based cleaning agents that are specifically formulated to meet the rigorous demands of semiconductor packaging. These cleaning products are engineered to efficiently remove contaminants from delicate components while ensuring minimal damage and maximizing device reliability.

With INVENTEC’s advanced cleaning solutions, manufacturers can maintain the highest levels of quality control throughout the production process.

To ensure a reliable production process and a long life-time of the equipment, maintenance cleaning is an important step not to overlook.

Typical contamination to be removed are burnt-in fluxes, condensed gas emissions and coatings on equipment, frames, pallets and conveyors. Also specific solutions for cleaning dispensing needles are required.

Our product are especially designed in order to guarantee a quick & easy cleaning process, so downtime of the production process is put at a minimum. All our maintenance products have a very low hazard risk & environmental impact, taking into account operators safety and health.

The purpose of an adhesive is to bond 2 substrates firmly together. For this reason breaking the bond and removing the adhesive can be a difficult job.

As there are many different kind of adhesives on the market, we recommend to contact us with your specific application in case you want to remove cured adhesives.

Un-cured electronic adhesives however are more easier to clean and for this we have some proven products in our range.

In order to avoid misprints and maintain a reliable production process, stencil cleaning is a standard operation in SMT manufacturing. Although manual cleaning can be used for low volume or prototyping, automatic processes are however recommended for large volume production.

When formulating these products, we have put great attention on fast cleaning cycles to minimize downtime, reducing water consumption and making sure the cleaning agent is not harmful to the cleaning equipment and stencils.

Also under stencil cleaning inside an SMT printer plays an important factor to maintain a reliable and consistent assembly process. For this application it is key the cleaning chemistry doesn’t change the viscosity of the solder paste when it comes in contact with the paste during the under stencil wipe cleaning. TOPKLEAN EL 7 is especially developed with this in mind and provide you with a low consumption & safe to use solution.