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3M NOVEC 73DE
- Removal of a wide range of contaminants
- Vapor phase process
- Very low HSE impact & very low surface tension
Alternative: PROMOSOLV NEO B1
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ECOFREC TF48
- No clean tacky flux
- Flip Chip, spheres soldering & components rework
- Excellent printing & high viscosity
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ECOFREC CMA 155
- Solvent based high rosin liquid flux
- Suitable for all fluxing processes
- Very good wetting & easy to clean
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ECOREL EASY 802M T4
- Sn62Pb36Ag2 leaded solder paste in Type 4
- No clean SMT printing process
- Robust assembly
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3M NOVEC 72DE
- Removal of a wide range of contaminants
- Vapor phase process
- High cleaning power & very low GWP
Alternative: PROMOSOLV NEO B1
