Tinning flux is a specialized flux designed to promote uniform solder coating (tinning) on component leads, wires, and PCB pads. It removes oxides and enhances wetting to ensure consistent solder coverage and reliable joint formation.

Tinning is used to pre-coat metal surfaces with solder to prevent oxidation, improve solderability, and ensure strong, conductive connections. It's commonly applied to wires, component leads, and reworked pads before final soldering.

While both promote wetting, tinning flux is typically more aggressive in removing oxides and preparing surfaces for full solder coverage. It’s optimized for immersion or brush application, and for situations requiring complete tinning of exposed metal.

Tinning flux is used in wire tinning, lead preparation for through-hole components, pad re-tinning during PCB repair, and for deoxidizing metal finishes such as copper, brass, or nickel. INVENTEC provides tailored formulations for these processes.

There are no-clean, rosin-based, and water-soluble tinning fluxes. Selection depends on whether cleaning is required after tinning, the metals involved, and the application method. INVENTEC offers all major types to suit industrial soldering environments.

Tinning flux can be applied by dipping, brushing, spraying, or with foam fluxers, depending on the component or wire geometry. Proper application ensures uniform solder coverage and minimal residue.

It depends on the flux type. No-clean tinning fluxes may not require removal if residues are minimal and non-corrosive. Water-soluble and more aggressive rosin-based fluxes typically require thorough cleaning after tinning. INVENTEC provides guidance based on your flux choice.

Yes. Modern tinning fluxes are fully compatible with lead-free alloys such as SAC305 or SnCu. INVENTEC offers lead-free-compatible tinning fluxes that deliver consistent wetting and performance across a range of metals.

Tinning flux is effective on copper, brass, nickel, and tinned surfaces. It helps remove oxides and promotes uniform solder adhesion, even on slightly tarnished or aged surfaces. Always ensure flux compatibility with the base metal and solder alloy.