In applications where long-term reliability and safety are paramount, such as life-critical or harsh-environment electronics, advanced SMT solder pastes ensure dependable performance beyond what conventional solutions can achieve.
High-Reliability Solder Paste solutions are essential for ensuring long-term performance in critical electronic applications, such as aerospace, automotive safety systems, medical devices, and industrial controls. These demanding environments require not just any Solder Paste for Electronics, but specifically engineered formulations that resist thermal cycling, mechanical stress, and harsh operating conditions. INVENTEC’s High Reliability Lead-Free Solder Paste products are developed to meet these challenges, providing superior joint integrity and long-term reliability without compromising on environmental or regulatory compliance.
Our High Reliability Alloy Solder Paste range incorporates proprietary high-reliability alloy used for solder paste applications, designed to exceed industry standards in terms of thermal fatigue resistance and mechanical strength. These advanced formulations are ideal for manufacturers seeking robust High-Reliability Solder Paste performance in both lead-free and low-voiding processes. Whether you are building safety-critical systems or electronics destined for extreme operational lifetimes, INVENTEC offers reliable, innovative solutions tailored to meet your most stringent soldering requirements.
In addition to these, INVENTEC also offers specialized formulations for High Chemical Reliability Solder Pastes solutions, designed to endure exposure to corrosive environments while maintaining their integrity over extended periods. These pastes are ideal for applications in harsh chemical environments where traditional solder pastes might fail.
Moreover, our High Mechanical Reliability Solder Pastes solutions are engineered to withstand the rigors of mechanical stress, providing the durability required in systems that are subject to constant movement or vibration, such as automotive and aerospace applications.
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Most no-clean flux residues after reflow are chemically inert to only some extend and cleaning or in other words, defluxing is an option still not always desired.
INVENTEC targeted from the early days high reliability applications. We were one of the first companies providing halogen-free formulations and to use BONO test to confirm the reliability of our solder products. This allowed us to fine-tune over those years well balanced solder solutions with highly inert flux residues.
The strength of the solder joint is defined by the mechanical reliability properties of the alloy. Some electronic assemblies have to deal with fast and extreme temperature changes, high temperatures, vibrations or need some resistance to drops. Choosing the right alloys for a particular need is key.
In the past, leaded alloys where the solution to electronic assemblies exposed to extreme temperature changes but due to environmental concerns they have been prohibited to use (with a few exceptions). Lead free alternatives, like SAC405, SAC378 and other variations have been introduced over the years. Inventec’s R&D team is constantly looking for improvements in this field.
Read moreInventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.