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ECOFREC TF48
- No clean tacky flux
- Flip Chip, spheres soldering & components rework
- Excellent printing & high viscosity
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ECOREL FREE 305-16
- Sac305 lead free alloy solder paste
- No clean smt printing process
- Robust Assembly
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ECOREL FREE 405Y-21
- SAC405 solder paste
- No clean SMT printing process
- Great thermal cycling performance
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PROMOCLEAN TP 186B
- Removing varnish, resins, paints, glues, inks & lacquers
- Aqueous immersion & co-solvent process
- Very low environmental impact
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CO-SOLVENT CLEANING
EFFICIENT, SAFE AND PRODUCTIVE PROCESS FOR THE ELECTRONICS INDUSTRY.
The co-solvent cleaning process removes organic and mineral residues from solder pastes and solder fluxes in a short cycle time.
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ECOREL FREE 305-WS12
- Sac305 lead free solder paste
- SMT printing process
- Excellent wetting properties
