AMTECH solder pastes, solder powders, and process support products, providing a highly complementary addition to the full line of INVENTEC products for the electronic assembly marketplace
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Following the missappropriation by one of its terminated distributor, INVENTEC USA has filed a lawsuit. Indeed, the terminated distributor missappropriated INVENTEC USA’s AMTECH trademarks and trade names, but also INVENTEC USA’s entire product naming system, duplicating over 50 product names.
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Read moreAMTECH offers a wide variety of solder paste, including
no-clean, water washable, and RMA formulations in jars, syringes, cartridges, and ProFlow Cassettes. We offer the industry’s best turnaround time and can ship to meet your most challenging just-in-time (JIT) requirements.
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Trusted by professionals worldwide, AMTECH™ solder paste delivers exceptional printability and consistent, high-quality solder joints. Its advanced formulations minimize defects such as voiding and bridging while ensuring excellent wetting and reliable reflow characteristics.
AMTECH tacky fluxes are designed to complement our entire product line, including no-clean, water washable, and RMA formulations. Our advanced chemistries can be used for general touch-up and rework, attaching spheres to microelectronic packages, and soldering Flip Chip components to various PCB substrates.
Trusted by professionals worldwide, AMTECH™ solder flux delivers excellent cleaning action and optimal solder flow across various applications. Its advanced formula ensures superior wetting, minimal spattering, and reduced residue.
AMTECH bar solderis carefully manufactured using high-purity, conflict-free metals that meet and often exceed stringent IPC industry standards. We offer our bar solder in a wide range of standard alloys and can custom-produce it in non-standard alloys to suit specific application needs.
Trusted by professionals worldwide, AMTECH™ bar solder delivers superior quality and strong, dependable solder joints. Its exceptional purity ensures minimal dross formation, reduced oxidation and improved wetting, making it the ideal choice for soldering processes.
AMTECH core wire is manufactured from high purity “conflict free” metals that meet and exceed all relevant IPC and ASTM B32 standards. Our core wire is available with 1.1, 2.2, & 3.3% flux core in most wire diameters and in many alloys, including lead-free formulations. Our core wire is packaged in easy to use evenly wound rolls.
Trusted by professionals worldwide, AMTECH™ solder wire offers smooth feed, excellent wetting, and reliable joint strength. Its high-purity core flux ensures minimal spatter and residue, making it ideal for precision hand soldering and automated assembly.
Engineered for consistent performance, AMTECH™ solder powder features tight particle size distribution and exceptional purity. It ensures reliable paste performance, excellent wetting, and consistent reflow, making it ideal for high-precision solder paste formulations.
Advanced Metals Technology Inc. (AMT), founded in 1978, is a global leader in the production of electronic-grade solder powders and spheres, known for their low oxide content and precise sizing. The company uses a proprietary separation process to maintain high quality while keeping production costs low. Through its ISO 9001:2008 certified subsidiary, Amtech, Inc., AMT also supplies top-tier solder pastes and fluxes to the electronic assembly market. Within six months of its founding, AMT began full-scale production and quickly became the main supplier to U.S. solder paste manufacturers.
Read moreAMTECH manufactures solder spheres and preforms from high purity “conflict free” metals that meet and exceed IPC and MIL standards. Our preforms are custom manufactured to strict tolerances, consistently delivering the desired amount of solder. Our solder spheres are available in all standard sizes and alloys. Custom sizes and alloys are available upon request.
AMTECH™ solder spheres provide uniform size and high purity for dependable solder joint formation. Designed for BGA, CSP, and flip-chip applications, they ensure excellent coalescence, reduced voiding, and consistent reflow characteristics.
Dispensing flux into confined areas can be problematic. Use of a flux dispensing pen helps to solve this problem because the flux pen works like a marking pen, dispensing just the right amount of flux where needed. After a certain number of applications, the felt tip starts to wear down, so replacement tips are available. For better dispensing control, consider using a tacky flux instead of an alcohol based flux.
Pin holes are formed by moisture that is trapped within or beneath the solder. When the moisture comes into contact with the component-lead, solder paste, through-hole, wire or material under elevated temperatures, the water can begin to boil, causing pin holes to be formed by trapped or escaping water vapor.
When soldering silver or silver-plated component leads, adding a small amount of silver (typically 2%) to the solder helps prevent the silver found on the component lead from migrating onto the solder, which can result in a weak or brittle solder connection.
AMTECH offers 100 grams of paste in a standard 30cc syringe, as well as 35 grams of paste in a standard 10cc syringe. A 30-guage needle is the smallest size recommended for dispensing SMT solder paste (Type 6 powder). Plungers and needles are available upon request.
Sn60Pb40 solder paste has a plastic range that allows it to lay down a slightly thicker coating of solder than Sn63Pb37, which is often preferred for lead tinning or similar applications. By contrast, Sn63Pb37 solder is eutectic, with no plastic range, and generally flows better than Sn60Pb40, making it the preferred solder paste solution for surface mount and wave soldering applications.
Under normal circumstances, rosin flux residues are non-conductive and non-corrosive and thus do not have to be removed from a printed circuit assembly, except perhaps for aesthetic reasons. However, in situations where the working temperature of the PCB exceeds 200°F, rosin flux residues can melt and become conductive. In such instances, the rosin flux needs to be removed.
Dross is generated by a combination of heat and agitation that caused oxides to form in various solders. As the solder pot gets hotter, and with increased agitation, the faster the dross gets generated. Dross formation can be reduced or eliminated by the use of nitrogen, which prevents oxygen form reacting with the outer surface of the solder. Dross reducing agents can also be used to minimize tin and lead oxides by releasing oxygen into the air. When using dross-reducing gents, be careful to follow the instructions on the product data sheet and SDS, where applicable.
AMTECH dose not offer any solder products that can be used for soldering to aluminum.
A thermocouple works by measuring the change in resistance of two dissimilar metals joined in a welded bead. If you were to join the two metals with solder, the thermocouple would provide meaningless numbers. In some cases it is possible to surround or encapsulate a thermocouple wire without forming a metallurgical bond. To fix a broken thermocouple, you can attempt to re-weld the thermocouple bead. When attaching a thermocouple to a PCB for reflow profiling, you generally have two choices: utilizing a high temperature alloy to encapsulate the thermocouple; or using a cyan-acrylate adhesive product to attach the thermocouple to the PCB.
Chemical disposal regulations vary form state to state and from country to country. We suggest that you contact your local EPA office to verify that proper disposal requirements are being followed. An EPA representative can also recommend qualified hazardous waste handlers in your area. Prepare in advance by having copies of all relevant product data sheets and Safety Data Sheets (SDS) available for review by a certified hazardous waste disposal expert.
When molten solder is exposed to air it can oxidize and create dross, which can appear as gold or a purple-blue in color. Formation of tin oxide is normal and generally does not degrade the reliability of the solder. This discoloration can be prevented by the use of a dross inhibitor, which is generally available as an anti-oxidant powder or pellet.
The typical solder paste formula consists of 90% metal and 10% flux by weight, and 45% metal and 55% flux by volume.
Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.