- No clean tacky flux
- Leaded/ Lead-free soldering
- Excellent wetting & transparent residues
This is the 3th generation of the famous NC-559 tacky flux. Developed to achieve even better wetting and a more clear transparent residue. It is formulated for syringe application, stencil printing and rework processes on all PCB surface finishes.
AMTECH NC-559-V3 performs excellent for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.
- Excellent wetting compatibility on most board finishes
- Wide process window
- High temperature compatible
- Clear residue
- ROL0 flux classification
- RoHS & REACH compliant