• No clean tacky flux
  • Leaded/ Lead-free soldering
  • Excellent wetting & transparent residues

This is the 3th generation of the famous NC-559 tacky flux. Developed to achieve even better wetting and a more clear transparent residue. It is formulated for syringe application, stencil printing and rework processes on all PCB surface finishes.

AMTECH NC-559-V3 performs excellent for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.






  • Excellent wetting compatibility on most board finishes
  • Wide process window
  • High temperature compatible
  • Clear residue


  • ROL0 flux classification
  • RoHS & REACH compliant

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.