Search
-
-
-
TOPKLEAN EL 20D
- Removal of flux residues
- Solvent vacuum process
- Thermally and chemically stable in use
-
BLUE GOLD
- Degreasing & particle removal from equipment in contact with oxygen
- Aqueous spray & immersion process
- Passes ASTM F-495 and ARP 1775A norm
-
ECOREL FREE 305-28
- SAC305 lead free solder paste
- No clean SMT printing process
- Robust assembly process
-
ECOREL EASY SPA-15
- SnPbAg leaded solder paste
- No clean SMT printing process
- Excellent performance for ultrafine-pitch
-
ECOFREC 303
- Waterbased VOC free, no-clean liquid flux
- Soldering either with air or nitrogen controlled atmosphere
- High reliability
-
ECOFREC 202
- Solvent based no-clean liquid flux
- Wave & selective soldering
- High reliability and no visual residues
-
