ECOREL HT 301T
High temperature leaded solder paste
- Pb93,5Sn5Ag1,5 Leaded solder paste
- No clean printing process
- Low voids & high reliability
ECOREL HT 301T
A No-Clean solder paste with high lead content (Pb93,5Sn5Ag1,5), designed for power semiconductors and high temperature assembly of micromodules and embedded systems. Formulated in order to achieve very low levels of voiding, especially for power components (QFN, DPAK, etc.) and to remove easily the flux residues when post reflow cleaning is required.
FEATURES
| SPECIFICATIONS | ECOREL HT 301T T3 |
|---|---|
| Alloy | Pb93,5Sn5Ag1,5 |
| Melting point (°C/°F) | 296–301°C / 565–574°F |
| Metal content (%) | 90 |
| Post reflow residues | Approximately 3% by w/w |
| Halogen content | No Halogen |
| Powder size | 25–45 microns / Type 3 |
| Spiral pump Viscosity (Pa.s 25°C) | Typical 75 |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
CHARACTERISTICS
| CHARACTERISTICS | VALUES | TEST METHOD |
|---|---|---|
| Flux Classification | ROL0 | ANSI/J-STD-004 |
| Flux Classification | 113 | ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| SIR (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004 / Bellcore |
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PERFORMANCE
- Low void level to improve heat dissipation
- Very good wetting on NiAu, Ni, NiP, and Cu lead frames
- Easy-to-clean flux residues
COST
- Increase lifetime and reliability of your product, hence reduces risk of premature failures.
- Fast paste-printing speed
HSE
- No CMR containing substances
- No Halogen
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.