ECOFREC 303

ECOFREC 303

Water based no-clean liquid flux

  • Water based VOC free, no-clean liquid flux
  • Soldering either with air or nitrogen controlled atmosphere
  • High reliability
ECOFREC 303

Is a low residue, no-clean, VOC (Volatile Organic Compound) free flux. Excellent soldering results within lead-free as well as leaded wave- and selective soldering processes are achieved while common solder balling issues are significantly reduced.

FEATURES
SPECIFICATIONS ECOFREC 303
Appearance Colorless liquid
Solid content (%) 3.5
Acid index (mg KOH/g) 32
Density at 20°C (g/ml) 1.005 – 1.013
Halogen content No halogen
Flash point No

CHARACTERISTICS
CHARACTERISTICS VALUES METHOD
Flux Classification ORL0 ANSI/J-STD-004
Copper mirror Pass ANSI/J-STD-004
Chromate paper Pass ANSI/J-STD-004
SIR (IPC) Pass ANSI/J-STD-004
Bono Corrosion test (85°C / 85% HR – 15 days) Pass / Corrosion Factor = 1.1% Inventec procedure

Benefits

PERFORMANCE

  • Compatible with a wide range of solder mask
  • Compatible with different PCB lead-free finishing as Ni/Au, Sn, Ag, HAL and OSP
  • No microballing
  • Possible to use with leaded and lead-free product

COST

  • Passes Bono test to guarantee a long life time of your product.
  • Avoid possible VOC taxes

HSE

  • No CMR substances
  • VOC free
  • Halogen & amine free
  • Non flammable

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.