CO-SOLVENT CLEANING

EFFICIENT, SAFE AND PRODUCTIVE PROCESS FOR THE ELECTRONICS INDUSTRY.

The co-solvent cleaning process removes organic and mineral residues from solder pastes and solder fluxes in a short cycle time.

• Cleaning: The low viscosity of the mixture Topklean™ EL 20 and 3M™ Novec™ 71IPA allows for the cleaning of miniaturized, high density boards and hard to reach areas.
• Liquid phase rinsing : 3M™ Novec™ 71IPA provides high performance rinsing of complex board geometries. Due to its low surface tension, it penetrates into very tight spaces, where a water molecule cannot go. This ensures a complete removal of Topklean™ EL 20.
• Vapor phase rinsing: the vapor of pure 3M™ Novec™ 71IPA condenses and drips across the board for a final rinse
• The drying takes place in the vapor phase and continues in the cold zone for a quick and optimal finish.

WHAT ARE THE ADVANTAGES OF THE CO-SOLVENT PROCESS?

*A dedicated PCA kit to monitor bath status is available upon request.