High-Volume PCB Assembly Solder Paste Solutions

Our high-volume PCB assembly solder paste solutions are engineered for optimal performance, delivering precision, reliability, and efficiency to meet the demands of fast-paced, large-scale production environments.

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Maximize Efficiency with Robust Solder Paste for High Volume PCB Assembly


Discover how our robust SMT solder paste solutions are engineered to enhance process stability, ensure repeatable performance, and maximize production efficiency in demanding high volume PCB assembly environments.

In today’s competitive electronics manufacturing landscape, high volume PCB assembly demands precision, repeatability, and robust process control. A key factor in achieving consistent results at scale is the performance of your solder paste.

Variability in printing and soldering can arise from a wide range of influences—equipment types, stencil design, print parameters, reflow methods, and more. In high volume PCB assembly, these factors can significantly affect throughput and yield. That’s why choosing the right solder paste is critical.

Our line of robust assembly solder paste is specially formulated for the needs of high volume PCB assembly environments. These pastes are engineered to deliver:

  • A broader process window to accommodate diverse production setups common in high volume PCB assembly
  • Reliable, repeatable reflow results for minimized defect rates
  • Enhanced printability and stencil release, even in fine-pitch and high-density designs
  • Consistent wetting and strong solder joints for long-term reliability in high volume PCB assembly
  • Low residue for easier post-solder cleaning and inspection

By choosing our robust solder paste solutions, manufacturers gain the stability and process resilience needed to support efficient, scalable high volume PCB assembly.

Whether you’re producing consumer electronics, automotive PCBs, or industrial controls, our solder paste ensures every board meets your performance and quality standards. Designed for demanding, high-speed environments, our solder paste supports consistent, high-yield results in every phase of high volume PCB assembly.

When performance matters, and production can’t afford downtime, rely on a solder paste engineered for the challenges of high volume PCB assembly.

See Other SMT Solder Paste Processes


PRODUCT OVERVIEW

We only show below the most relevant and newest products in our range. If you don’t find a specific product, you will probably find it with our search option.

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  • Ecorel Free solder paste

    ECOREL FREE 305-28

    • SAC305 lead free solder paste
    • No clean SMT printing process
    • Robust assembly process
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  • Ecorel Free solder paste

    ECOREL FREE 387-28

    • SAC387 lead free solder paste
    • No clean SMT printing process
    • Robust assembly

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  • Ecorel Free solder paste

    ECOREL FREE 305-16

    • Sac305 lead free alloy solder paste
    • No clean smt printing process
    • Robust Assembly
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  • Tailor-made solution

    You do not find the perfect product ? We can also offer you some tailor-made solution
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Technical support

Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.

Depending on your request, we provide online or onsite support

  • to select the right product based on your specific needs
  • to assist you in your product qualification process
  • to guide you with the initial set up of you process at all your worldwide manufacturing facilities
  • to provide fast response on technical issues which could occur at any time during mass production.
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Technical support
Free-of-Charge cleaning & coating trials

Free-of-Charge cleaning & coating trials

Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.

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