Our range of advanced SMT glue cleaning solutions is designed to deliver precision, effectiveness, and reliability, ensuring thorough adhesive removal for flawless electronics cleaning and efficient semiconductor cleaning in today’s high-performance assemblies.
SMT glue (Surface-Mount Technology glue) plays a critical role in securely bonding substrates during electronic and semiconductor device assembly. However, removing cured SMT adhesives can be challenging due to their strong bonding properties, requiring specialized cleaning solutions tailored to your specific adhesive type.
While cured adhesive removal often needs expert guidance and customized products, uncured electronic adhesives are easier to clean. INVENTEC offers proven, safe, and effective products specifically formulated for cleaning glue in both electronics cleaning and semiconductor cleaning processes, ensuring component integrity is maintained.
If you face difficulties removing adhesive residues or need help selecting the right solution, INVENTEC’s expertise and advanced product range provide reliable and efficient options for seamless SMT glue removal and overall electronics cleaning performance.
INVENTEC delivers specialized SMT glue cleaning solutions designed to optimize electronics and semiconductor cleaning while preserving component performance.
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SMT glue cleaning refers to the process of removing adhesive residues used in surface mount technology (SMT) assembly to ensure clean surfaces and reliable component placement.
Residues from SMT adhesives can interfere with solderability, cause contamination, and affect electrical performance, so thorough cleaning is essential for quality assembly.
Common adhesives include epoxy-based glues, acrylic adhesives, and UV-curable adhesives used for component fixation during SMT assembly.
Cleaning methods include solvent-based cleaning, ultrasonic agitation, and aqueous cleaning with specialized chemistries designed to break down adhesive residues without damaging components.
Yes, INVENTEC offers advanced cleaning solutions formulated to effectively remove SMT adhesive residues while being safe for sensitive electronic materials.
Many SMT glue cleaning steps can be automated in production lines, using spray-in-air or ultrasonic cleaning systems to ensure consistent residue removal.
Effective removal of adhesive residues prevents contamination-related defects, improves solder joint quality, and enhances overall device reliability.
Cleaning agents must comply with environmental regulations concerning VOCs, biodegradability, and toxicity; INVENTEC’s formulations prioritize eco-friendly performance.
Verification involves visual inspection, surface contamination analysis, and functional testing to ensure adhesives are fully removed without residue.
Yes, INVENTEC Performance Chemicals provides specialized cleaning chemistries tailored for effective and safe SMT glue cleaning in electronics manufacturing.
Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
In order to know if our products reach your expectations on your specific part and according to your desired process, we provide FREE-OF-CHARGE cleaning trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. You want to attend the trials? We are happy to welcome you.