ECOREL FREE 305-28
Solder paste for High Volume & Complex boards assembly
- SAC305 lead free solder paste
- No clean SMT printing process
- Robust assembly process
ECOREL FREE 305-28
Especially designed for high volume & complex boards assembly. The paste has a very good pin-in-paste performance within a large process window to achieve flawless, reproducible & stable operation. Furthermore, it shows ideal performance when soldering medium to large boards.
ECOREL FREE 305-28 formulation is also available in other alloys and particle sizes upon request.
FEATURES
| SPECIFICATIONS | ECOREL FREE 305-28 T4 |
|---|---|
| Alloy | Sn96,5Ag3Cu0,5 |
| Melting point (°C/°F) | 217 / 422 |
| Metal content (%) | 88.5 |
| Post reflow residues | Approximately 5% by w/w |
| Powder size | 20 – 38 microns / Type 4 |
| Spiral pump* Viscosity (Pa.s 25°C) | Typical 135 |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
CHARACTERISTICS
| CHARACTERISTICS | VALUES | METHOD |
|---|---|---|
| Flux Classification |
ROL0 113 |
ANSI/J-STD-004 ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| SIR (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004 / Bellcore |
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PERFORMANCE
- Very good wetting properties to all surface finishes, including OSP
- Robust assembly under a large process window
- Low flux spattering & low residue spread
COST
- Minimizes line-down time & the need for re-work
- Maximizes throughput
HSE
- Lead Free
- Free of CMR containing substances
PROCESS RECOMMENDATION
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.
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