ECOREL FREE 305-21
High reliability solder paste
- SAC305 lead free solder paste
- No clean SMT printing & dispensing process
- High reliability applications
ECOREL FREE 305-21
Is especially designed for applications which needs high chemical reliability and where post reflow cleaning is not an option. This solder paste has excellent BONO test values, which is a key attribute to control the risk for electrochemical migration (ECM), especially when exposed to challenging conditions of high temperature and humidity.
The chemistry of this product is also available with other alloys or particle sizes on request.
FEATURES
STANDARD OPTIONS
| SPECIFICATIONS | ECOREL FREE 305-21 | ECOREL FREE 305-21 T4 | ECOREL FREE 305-21 T5 |
|---|---|---|---|
| Alloy | Sn96,5Ag3Cu0,5 | Sn96,5Ag3Cu0,5 | Sn96,5Ag3Cu0,5 |
| Melting point (°C/°F) | 217 / 422 | 217 / 422 | 217 / 422 |
| Metal content (%) | 88.5 ±0.5 | 88.5 ±0.5 | 88 ±0.5 |
| Post reflow residues | Approximately 5% by w/w | Approximately 5% by w/w | Approximately 5% by w/w |
| Halogen content | No Halogen | No Halogen | No Halogen |
| Powder size | 25–45 microns / Type 3 | 20–38 microns / Type 4 | 15–25 microns / Type 5 |
| Spiral pump Viscosity (Pa.s 25°C) Malcom at a 10 rpm rotation speed |
Typical 165 | Typical 165 | under evaluation |
| Viscosity (Pa.s 20°C) Brookfield RVT TF at 5 rpm |
n.a | n.a | 900–1100 |
DISPENSING OPTIONS
| SPECIFICATIONS | ECOREL FREE 305-21 T5-85 |
|---|---|
| Alloy | Sn96,5Ag3Cu0,5 |
| Melting point (°C/°F) | 217 / 422 |
| Metal content (%) | 85 |
| Post reflow residues | Approximately 5% by w/w |
| Halogen content | No Halogen |
| Powder size | 15–25 microns / Type 5 |
| Spiral pump Viscosity (Pa.s 25°C) Malcom at a 10 rpm rotation speed |
under evaluation |
| Viscosity (Pa.s 20°C) Brookfield RVT TF at 5 rpm |
550–750 |
CHARACTERISTICS
| CHARACTERISTICS | VALUES | TEST METHOD |
|---|---|---|
| Flux Classification | ROL0 | ANSI/J-STD-004B |
| Flux Classification | 113 | ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004B |
| Copper corrosion | Pass | ANSI/J-STD-004B |
| SIR (IPC) | Pass | ANSI/J-STD-004B |
| SIR (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004B / Bellcore |
| Bono Corrosion test (85°C / 85% HR – 15 days) | Pass – Corrosion Factor <8% | Inventec procedure |
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Although fully in line with safety & environmental regulations, this product doesn`t match our strict criteria to be labelled as a Greenway product.
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Benefits
PERFORMANCE
- Very good wetting properties on all surface finishes, including OSP
- No graping, even on very small deposits
- Transparent colorless residue, even after multiple reflow cycles
COST
- Minimizes line-down time & the need for re-work
- Good first pass yield testability in ICT
HSE
- Lead free
- No halogen
- Free of CMR containing substances
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.