Discover the future of cooling at SEMICON Japan 2025
Join our Japan team at Semicon Tokyo/ Tokyo Big Sight Booth E4625 from December 17th to 19th and we will introduce you to the next generation of cooling solutions with our revolutionary Thermasolv range.
At our booth, visitors will discover how Inventec’s Cooling technologies are helping data centers and electronic manufacturers meet today’s thermal management challenges while reducing environmental impact.
Inventec offers advanced liquid cooling solutions tailored to your needs. Whether it is semiconductor manufacturing, testing or processing, 2 phase direct-to-chip cooling, 1 or 2 phase immersion cooling, cold tube or plate cooling as well as water-based cooling, our Thermasolv range ensures performance, reliability and sustainability across next generation applications.
Thermasolv provides a simplified approach to cooling, providing greater design flexibility and ease of implementation. It also reduces water consumption, minimizes space requirements, and lowers energy consumption by 95%, making it an environmentally friendly choice.
Whether you’re looking to improve system efficiency, optimize energy use, or future-proof your data infrastructure, our experts will be there to guide you through the possibilities. Explore with them one-phase to two-phase immersion cooling and discover how Thermasolv can transform your data center operations.
Let’s shape the future of Cooling together!
Visit us at SEMICON Japan 2025 – Tokyo Big Sight – BOOTH E4625
🗓 December 17–19, 2025
Want to learn more?
Click here to get in touch with our team
