INVENTEC Performance Chemicals will participate in the Europe Data Center Cooling & Thermal Management Forum 2026, taking place on November 9–10 in Frankfurt, Germany.
As AI and high-density computing reshape data center infrastructure, advanced liquid cooling technologies are becoming essential for efficient and reliable thermal management. INVENTEC will highlight its THERMASOLV cooling fluids, designed for immersion and direct-to-chip cooling applications.
Join Oliver Domeisen on November 9 at 17:10 for his presentation, “Beyond Air Cooling – Advanced Fluids for High-Density Data Centers”, exploring fluid solutions for immersion and direct-to-chip cooling technologies.
