Our full range of advanced misprint & stencil cleaning solutions is designed to deliver precision, efficiency, and reliability, ensuring optimal cleaning performance and high-quality results in SMT printing and electronics manufacturing.
In SMT printing and PCB SMT assembly, effective stencil cleaning is vital to prevent costly misprints and maintain high-quality production. Automated cleaning solutions, like TOPKLEAN EL 7, offer optimized performance with fast cleaning cycles that protect both stencils and cleaning equipment, ensuring consistent workflow efficiency.
Maintaining the integrity of solder paste viscosity during under stencil wipe cleaning is critical to avoid affecting paste performance. INVENTEC’s specialized products are designed to deliver thorough cleaning without compromising paste quality, making them ideal for both high-volume semiconductor cleaning processes and precise electronics cleaning in SMT manufacturing.
By integrating INVENTEC’s advanced misprint and stencil cleaning solutions, manufacturers can reduce downtime, enhance throughput, and ensure reliable, high-quality assembly processes across electronics and semiconductor production lines.
INVENTEC provides high-performance misprint and stencil cleaning solutions, including TOPKLEAN EL 7, to ensure reliable and efficient SMT and semiconductor manufacturing processes.
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Misprint and stencil cleaning refers to the removal of excess or incorrect solder paste deposits (misprints) and the cleaning of stencils used in SMT solder paste printing to maintain process accuracy and quality.
Regular cleaning of stencils prevents clogging of apertures, ensures precise solder paste deposition, and reduces defects such as insufficient or excessive solder, improving assembly yield.
Misprints are often caused by stencil damage, clogged apertures, misalignment, or improper solder paste viscosity and can lead to solder bridging, open joints, or tombstoning.
Cleaning methods include manual wiping, automated stencil cleaning machines using solvents or aqueous solutions, and ultrasonic cleaning to effectively remove solder paste residues.
Yes, INVENTEC offers cleaning chemicals specifically formulated to dissolve and remove solder paste residues quickly while preserving stencil integrity and reducing corrosion risks.
Frequency depends on production volume and solder paste type but typically occurs every few print cycles or shifts to maintain consistent paste release and prevent defects.
Yes, promptly cleaning misprints reduces solder defects, rework, and scrap rates, ensuring higher first-pass yields and reliable solder joints.
Automated cleaning systems enhance efficiency, reduce downtime, and ensure consistent cleaning quality, making them ideal for high-volume SMT production lines.
Cleaning agents should comply with environmental regulations concerning VOCs and waste treatment; INVENTEC emphasizes eco-friendly and biodegradable solutions.
Yes, INVENTEC Performance Chemicals offers a range of cleaning products tailored for efficient misprint removal and stencil cleaning in electronics manufacturing.
Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
In order to know if our products reach your expectations on your specific part and according to your desired process, we provide FREE-OF-CHARGE cleaning trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. You want to attend the trials? We are happy to welcome you.