Showing 25–36 of 145 results
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BLUE GOLD
- Degreasing & particle removal from equipment in contact with oxygen
- Aqueous spray & immersion process
- Passes ASTM F-495 and ARP 1775A norm
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CO-SOLVENT CLEANING
EFFICIENT, SAFE AND PRODUCTIVE PROCESS FOR THE ELECTRONICS INDUSTRY.
The co-solvent cleaning process removes organic and mineral residues from solder pastes and solder fluxes in a short cycle time.
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ECOFREC 200
- Solvent based no-clean liquid flux
- Wave & selective soldering
- Excellent wetting & high reliability
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ECOFREC 202
- Solvent based no-clean liquid flux
- Wave & selective soldering
- High reliability and no visual residues
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ECOFREC 205
- Solvent based no-clean liquid flux
- Wave & selective soldering
- Excellent wetting on all board finishes
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ECOFREC 303
- Waterbased VOC free, no-clean liquid flux
- Soldering either with air or nitrogen controlled atmosphere
- High reliability
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ECOFREC 320
- Water-based no-clean liquid flux
- Wave & selective soldering
- High reliability & excellent wetting
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ECOFREC CMA 155
- Solvent based high rosin liquid flux
- Suitable for all fluxing processes
- Very good wetting & easy to clean
