Soldering

ECOREL 305-16LVD

ECOREL 305-16LVD

Low voids lead free solder paste

  • SAC305 lead free solder paste
  • No clean SMT printing & dispensing process
  • Excellent low voiding
ECOREL 305-16LVD

Is especially designed to reduce the dimension and amount of voids. This is especially beneficial when soldering bottom terminated components and for applications where excellent thermal management is crucial. A reduction of voids contributes to a better heat dissipation, more reliable electrical connection and a better intermetallic solder joint strength.

This solder paste is furthermore well balanced in terms of wettability, reliability, good compatibility with most conformal coating in the market and transparent clear residues. Besides the type 4 solder paste formulations are made from 100% recycled metals and paste in jar packaging can be stored at room temperature, which contributes to an overall reduction in CO2 emissions.

The chemistry of 16LVD is also available with other alloys and particle sizes on request.

 Ecorel 305-16LVD 88.0T4: ~72-hour Stencil life

FEATURES
STANDARD OPTIONS

SPECIFICATIONS ECOREL 305-16LVD 88.0T4 ECOREL 305-16LVD 88.5T4 ECOREL 305-16LVD 88.5T5
Alloy Sn96,5Ag3Cu0,5 Sn96,5Ag3Cu0,5 Sn96,5Ag3Cu0,5
Melting point (°C/°F) 217 / 422 217 / 422 217 / 422
Metal content (%) 88 88.5 88.5
Post reflow residues Approximately 5% by w/w Approximately 5% by w/w Approximately 5% by w/w
Halogen content No Halogen No Halogen No Halogen
Powder size 20–38 microns / Type 4 20–38 microns / Type 4 15-25 microns / Type 5
Spiral pump* Viscosity (Pa.s 25°C) Typical 135 Typical 155 Typical 155

*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.

SPECIFICATIONS ECOREL 305-16LVD 88.0T6
Alloy Sn96,5Ag3Cu0,5
Melting point (°C/°F) 217 / 422
Metal content (%) 88
Post reflow residues Approximately 5% by w/w
Halogen content No Halogen
Powder size 5-15 microns / Type 6
Spiral pump* Viscosity (Pa.s 25°C) **Range 275

*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
**Slight adjustments in viscosity possible after finalizing full industrialization test procedure.

DISPENSING OPTIONS
SPECIFICATIONS ECOREL 305-16LVD 85.0T5
Alloy Sn96,5Ag3Cu0,5
Melting point (°C/°F) 217 / 422
Metal content (%) 85
Post reflow residues Approximately 5% by w/w
Halogen content No Halogen
Powder size 15-25 microns / Type 5
Spiral pump* Viscosity (Pa.s 25°C) Typical 65

*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.

CHARACTERISTICS
CHARACTERISTICS VALUES METHOD
Flux Classification ROL0 ANSI/J-STD-004B
Flux Classification 113 ISO 9454
Solder balling test Pass ANSI/J-STD-005
Copper mirror Pass ANSI/J-STD-004B
Copper corrosion Pass ANSI/J-STD-004B
SIR (IPC) Pass ANSI/J-STD-004B
SIR (Bellcore) Pass Bellcore
Electromigration (IPC / Bellcore) Pass ANSI/J-STD-004 / Bellcore
Bono Corrosion test (85°C / 85% RH for 15 days) Pass – Corrosion Factor < 8% Inventec procedure
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MAIN CONTRIBUTORS WHICH REDUCE IMPACT:

HUMAN HEALTH & SAFETY

  • Lead-free alloy
  • Non-toxic & no CMR containing substances

ENVIRONMENT PROTECTION & RESOURCES SAVINGS

  • No aquatic toxicity
  • Made from recycled metals, reducing substantially carbon footprint
  • No-clean formulation, minimizes the need for post reflow cleaning
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Benefits

PERFORMANCE

  • Low voiding to offer great heat dissipation
  • Very good wetting on all surface finishes, including OSP
  • Transparent colourless residue, even after multiple reflow cycles

COST

  • Long stencil lifetime reduces equipment downtime and paste waste
  • Increase lifetime and reliability of your product, hence reduces risk of premature failures.

HSE

  • No Halogen
  • Lead Free
  • Free of CMR containing substances

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.

Applications

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LOW VOID SOLDER PASTE FOR BETTER HEAT DISSIPATION IN AUTOMOTIVE ELECTRONICS

Electric motor, power controller, inverter, converter and other electronics related to the powertrain of an electric car are during operations