Our full-range offering of advanced solder paste repair solutions is designed to deliver precision, reliability, and efficiency in rework soldering, ensuring high-quality solder repair for today’s complex electronic assemblies.
Advanced solder paste repair solutions are essential in the rework and restoration of complex electronic assemblies. These solutions are specifically engineered for precise application and reliable results on high-density packages like BGAs (Ball Grid Arrays) and QFNs (Quad Flat No-leads).
At the heart of this method lies high-performance solder paste, a blend of flux and solder powder that delivers exceptional reflow characteristics. Applied directly to the target joint, the paste enables technicians to execute controlled reflow processes that restore electrical integrity and mechanical durability.
These repair solutions are ideal for rework soldering in limited-access areas, providing strong adhesion, improved solder wetting, and minimal residue. Convenient syringe packaging enhances precision and ease of application, making solder paste repair both accurate and efficient.
INVENTEC offers a full range of solder paste repair solutions optimized for rework efficiency and long-term performance in electronics manufacturing.
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Read moreSolder paste repair solutions involve using specially formulated solder pastes designed for reworking, repairing, or touch-up of printed circuit boards (PCBs) and components. These pastes enable precise solder deposition and reliable joint formation during repair processes.
While solder flux focuses on cleaning and activating surfaces to promote wetting, solder paste contains both flux and solder alloy particles, enabling it to form new solder joints directly. Paste is ideal for rebuilding pads, filling gaps, or replacing components.
Repair solder pastes are often low-voiding, no-clean, or water-soluble types formulated for excellent tackiness and fine pitch compatibility. INVENTEC offers repair pastes optimized for rework applications, including lead-free alloys like SAC305.
Yes. Repair solder pastes can be applied manually using syringes, dispensing systems, or stencil printing for precise placement during PCB rework or component replacement.
Viscosity and tackiness affect paste handling and component placement. Properly formulated repair pastes provide consistent viscosity for easy dispensing and enough tack to hold components in place before reflow.
Yes, INVENTEC’s solder paste repair solutions are fully compatible with lead-free soldering processes, ensuring strong, reliable joints that meet RoHS and environmental standards.
Optimized reflow profiles with controlled temperature ramps and soak zones ensure complete solder alloy melting and flux activation, minimizing defects and promoting strong solder joints during repair.
By enabling precise rework and defect correction without replacing entire boards, solder paste repair reduces scrap rates, saves costs, and enhances overall manufacturing yield.
Challenges include ensuring pad adhesion, preventing bridging, and matching solder alloy composition. High-quality solder paste formulations like INVENTEC’s help overcome these challenges with consistent performance.
Yes, INVENTEC Performance Chemicals provides a range of solder paste repair solutions tailored for manual and automated rework processes, supporting lead-free and high-reliability electronic manufacturing.
Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.