Our high performance pressure and pressure-less sintering pastes for Die attach and substrate bonding.
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Sintering solutions are used as an alternative to solder paste power electronics in applications where high thermal and electrical conductivity, reliability, and mechanical strength are critical.
Some key areas where sintering is preferred include lead free die-attach, large area module attach, E-Vehicle, Energy conversion of Renewable energies, Optoelectronics and RF power devices.
Especially with the latest SiC and GaN developments operating at much higher power, using sintering interconnections with higher thermal and excellent electrical conductivity is crucial.
Key Advantages of our ECOREL™ SINTEC product range
1 High Thermal conductivity
ECOREL™ SINTEC sintering solutions achieve thermal conductivity values exceeding 300 W/mK,
providing exceptional heat dissipation and making them an ideal choice for high-power applications.
2 High shear strength
With a shear strength exceeding 50 MPa, robust interconnects are formed, enabling assemblies to easily
withstand Thermal Cycling Testing (TCT) from -55°C to +125°C for over 1000 cycles.
3 Room temperature storage
Most sintering pastes require refrigerated or frozen storage, but our sintering solutions can be stored
at room temperature, making them much easier to handle, while still providing a 6 months shelf life.
4 No nanoparticles
Unlike other sintering solutions available on the market, ECOREL™ SINTEC products are free of nanoparticles, making them safer for both users and the environment.
Additional Advantages
All-in-one Sintering Process
With ECOREL SINTEC AP90 it is possible to perform die Sintering & Substrate sintering in one step.
The All-in-One sintering process has the potential to reduce the total cost of ownership for such applications dramatically.
Ideally, an usually two-step process, die sintering and substrate sintering, can become a one step process: saving energy, consumables, and time by 50%.
Sintering is a process that joins metal particles by heating them below their melting point until they fuse together. In industrial soldering, sintering is used as an alternative to traditional soldering for creating high-performance electrical and thermal joints.
Unlike conventional soldering, which melts solder alloys to form joints, sintering uses pressure and heat to bond metal particles without fully melting them. This leads to joints with higher thermal conductivity, electrical performance, and mechanical strength.
Silver (Ag)-based nanoparticles are commonly used in sintering pastes due to their excellent electrical and thermal conductivity. INVENTEC offers advanced silver sintering pastes and powders tailored for industrial applications.
Sintering provides superior joint reliability, higher melting points, better thermal management, and improved resistance to thermal cycling. These benefits are critical in power electronics, automotive, and aerospace applications.
Sintering is widely used in automotive electronics, power modules, LED lighting, renewable energy systems, and aerospace, where high thermal and electrical performance is essential.
Common sintering processes include pressure-assisted sintering, low-pressure sintering, and pressureless sintering. Each method is chosen based on component sensitivity, throughput, and desired joint characteristics.
Yes, with proper equipment and process optimization, sintering can be integrated into production lines. INVENTEC supports customers with materials and technical expertise for smooth sintering process adoption.
Sintered joints offer significantly improved thermal conductivity compared to solder joints, facilitating efficient heat dissipation and enhancing overall device reliability and performance.
Challenges include controlling sintering temperature and pressure, preventing oxidation of particles, and ensuring compatibility with substrates. High-quality sintering pastes like those from INVENTEC help overcome these challenges.
Yes, INVENTEC Performance Chemicals offers a comprehensive range of silver nanoparticle sintering pastes and powders designed for high-reliability electronic packaging and power device assembly.
Sintering solutions are advanced processes used to create reliable electrical connections in high-performance electronic assemblies. They offer excellent thermal conductivity, mechanical strength, and long-term component reliability, making them ideal for demanding applications.
By integrating sintering materials and industrial sintering equipment into production lines, manufacturers can improve electrical performance, reduce failure rates, and enhance the durability of semiconductors, power modules, and other electronic components. These solutions are widely applied in automotive electronics, aerospace systems, and medical devices where high reliability is critical.
Key BenefitsSintering solutions provide exceptional thermal and mechanical bonding for Die attach and substrate bonding in advanced electronic assemblies. High-performance sintering pastes enhance electrical conductivity, improve thermal dissipation, and increase component reliability compared to conventional adhesives or solders.
Technical AspectsSintering pastes are engineered for both pressure and pressure-less sintering processes, ensuring uniform bonding without damaging delicate substrates. Optimized particle size distribution and paste formulation provide excellent flow and adhesion, while supporting high-throughput manufacturing in automated assembly lines.
ApplicationsSintering solutions are widely applied in semiconductor assembly, power electronics, and advanced substrates for automotive, aerospace & defense, and medical industries. These solutions improve device performance, ensure long-term thermal stability, and help manufacturers meet stringent reliability and safety standards.
In electric vehicles and hybrid powertrains, sintering techniques are used to connect power modules, battery packs, and high-voltage components. These processes ensure superior thermal management and reliable electrical performance under extreme conditions.
For aerospace electronics and defense systems, sintering solutions provide robust electrical connections for avionics, radar, and satellite modules. These processes ensure high reliability in extreme temperatures, vibrations, and harsh environmental conditions.
In medical electronics, sintering processes enable reliable connections for imaging sensors, diagnostic equipment, and implantable devices. This guarantees consistent electrical performance and long-term device reliability.
Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.