Jet Printing & Dispensing Solder Paste Solutions for Precision Electronics Assembly

High-performance jet printing and dispensing solder paste solutions designed for precision, flexibility, and reliability in advanced electronic assembly.

Advanced Jet Printing Solder Paste Solutions

Precision Without Contact – Tailored for Jet Dispensing Systems

At INVENTEC Performance Chemicals, our jet printing solder paste solutions are expertly engineered to deliver consistent, precise, and contactless solder deposition for modern jet dispensing systems. These solder pastes are formulated to maintain continuous and reliable print quality even in high-speed, high-accuracy manufacturing environments.

Compatible with leading jet dispensing equipment brands such as Mycronic, Vermes, Essemtec, and Musashi, our jet pastes ensure superior wetting, minimal voiding, and excellent repeatability—ideal for fine-pitch components, miniaturized PCBs, and LED assemblies.

Though the flux formulation is chemically inert for long-term stability, it remains easily cleanable using both water-based and solvent-based cleaning processes.

Key Benefits:

• Optimized for high-speed jet dispensing
• Consistent micro-dot formation and solder volume control
• Excellent compatibility with leading jet printing platforms
• Easy post-process cleaning
• Ideal for applications like SiP, SMT, BGA, and LED assembly

Dispensing Solder Paste Solutions

Smart Soldering Flexibility for Diverse Manufacturing Needs

Dispensing solder paste offers a flexible, adaptive solution for non-contact solder paste application in complex and high-mix assembly processes.
Whether applying solder paste into deep cavities, around irregular surfaces, or directly on already mounted components, INVENTEC’s advanced formulations support unmatched precision and reliability.

Our solder paste dispensing solutions are specially developed for use in automated dispensing systems, offering a wide viscosity range, excellent thixotropic properties, and precise dot size control—even within a single production cycle.

Perfect for applications in automotive electronics, medical devices, and aerospace electronics, our pastes are optimized for use in both traditional needle dispensing systems and modern jet dispensing machines.

Key Features:

• Wide adaptability for varied dispensing systems
• Accurate dot placement in 3D or irregular geometries
• Superior adhesion and wetting on challenging substrates
• Process-stable for both needle dispensing and jetting
• Low voiding, high reliability under harsh environments

Why Choose INVENTEC for Jet and Dispensing Solder Paste?

With decades of expertise in electronic assembly chemistry, INVENTEC delivers innovative, high-performance jet dispensing solder paste and dispensing solder paste technologies that meet the demands of next-generation electronics. Our commitment to cleaning compatibility, process efficiency, and customer-specific customization ensures optimal results from prototyping to mass production.

See Other SMT Solder Paste Processes

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