Ball Attach Semiconductor Packaging Process

Our advanced ball attach solutions are engineered to provide precise, reliable solder ball attach performance with excellent wetting, strong mechanical bonds, and consistent electrical connectivity—ideal for high-volume semiconductor packaging and demanding BGA ball attach process applications.

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Advanced Solutions for the Ball Attach Semiconductor Packaging Process


Discover how advanced soldering materials and processes enhance the ball attach stage of semiconductor packaging, ensuring high-reliability connections through precision-engineered solutions.

Modern semiconductor packaging relies on cutting-edge soldering technologies to meet the increasing demands for performance, miniaturization, and reliability. Among these, the ball attach step plays a pivotal role in securing electrical and mechanical connections within Ball Grid Array (BGA) packages.

The solder ball attach or BGA ball attach process involves the precise placement and reflow of solder balls—also referred to as solder spheres—onto substrates or wafers. These BGA balls serve as crucial contact points between the silicon die and the PCB, making the quality of each joint fundamental to overall device performance.

Specialized fluxes, solder pastes, and alloy formulations are developed to meet the high standards of thermal conductivity, electrical reliability, and mechanical strength demanded in today’s advanced semiconductor process workflows. These materials ensure optimal wetting, robust adhesion, and minimal voiding, resulting in consistent, high-strength connections.

Whether applied in initial solder ball attach operations or in BGA reballing scenarios for repair or rework, these advanced chemical solutions are designed for repeatable success and manufacturing efficiency. They are also compatible with both lead-free and leaded solder spheres, offering flexibility for diverse applications.

As semiconductor packaging continues to evolve, these soldering materials are adaptable to various substrate types, package formats, and process scales—from wafer-level to board-level assembly. This adaptability is key to addressing emerging challenges such as heat dissipation, signal integrity, and component density.

With decades of accumulated process knowledge, these technologies support manufacturers in achieving high-yield, cost-effective production while aligning with industry standards and next-generation requirements.

Key Benefits of Advanced Ball Attach Solutions:

  • Optimized solder ball attach formulations for consistent, high-yield production
  • Broad compatibility with lead-free and leaded solder spheres
  • Tailored fluxes and pastes for both BGA ball attach process and BGA reballing
  • Minimized voiding and improved joint reliability through superior wetting behavior
  • Applicable across various levels of semiconductor packaging, including wafer-level and chip-scale

Choose advanced materials and methods to elevate your ball attach operations and enhance the efficiency and reliability of your semiconductor process.

See Other Semicon Packaging Processes


PRODUCT OVERVIEW

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  • ECOFREC TF48

    • No clean tacky flux
    • Flip Chip, spheres soldering & components rework
    • Excellent printing & high viscosity
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  • ECOFREC TF49

    • Halogen free tacky flux
    • Flipchip & rework soldering
    • Low residue properties

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Technical support

Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.

Depending on your request, we provide online or onsite support

  • to select the right product based on your specific needs
  • to assist you in your product qualification process
  • to guide you with the initial set up of you process at all your worldwide manufacturing facilities
  • to provide fast response on technical issues which could occur at any time during mass production.
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Free-of-Charge cleaning & coating trials

Free-of-Charge cleaning & coating trials

Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.

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