Package Cleaning
Our advanced package cleaning solutions are engineered to precisely and efficiently eliminate contaminants from delicate semiconductor components, ensuring maximum device reliability, electrical performance, and yield—ideal for high-performance advanced package and semiconductor manufacturing environments.
Optimizing Performance with Advanced Package Cleaning Solutions in Semiconductor Manufacturing
In semiconductor manufacturing, maintaining device integrity and functionality is crucial. Effective cleaning package solutions are vital for removing contaminants like flux residues, microscopic particles, and organic impurities that can impact yield and device performance, especially in advanced package technology such as BGAs, CMOS, and flip chips.
INVENTEC offers cutting-edge electronics cleaning solutions tailored for these advanced packages, providing both water-based and solvent-based agents formulated to thoroughly clean sensitive components without damage. These products support improved process efficiency, higher device yields, and long-term reliability across the semiconductor manufacturing lifecycle.
With INVENTEC’s innovative package cleaning technologies, manufacturers can confidently enhance product quality and maintain a competitive edge in the fast-evolving semiconductor industry.
Key Advantages of Advanced Package Cleaning Solutions
- Specialized cleaning agents for water-based and solvent-based semiconductor cleaning processes
- Formulated to remove flux residues, microscopic particles, and organic or ionic contaminants
- Compatible with advanced package technologies including BGAs, CMOS, and flip chips
- Supports improved yield, reliability, and device longevity throughout semiconductor manufacturing
INVENTEC offers innovative package cleaning solutions optimized to protect sensitive semiconductor components and enhance manufacturing reliability in advanced package technology.
Explore More Cleaning Solutions Read FAQ
Read moreDiscover our eco-friendly PFAS-free vapor phase and co-solvent cleaning solution!
PROMOSOLV NEO A1
- Light oil & particles removal / rinsing & drying
- Vapor phase, co-solvent, flushing & drying process
- No GWP & PFAS free
This is a product
Package Cleaning – Frequently Asked Questions (FAQ)
What is package cleaning in semiconductor and electronics manufacturing?
Package cleaning refers to the process of removing contaminants such as flux residues, particulates, and oils from semiconductor and electronic device packages to ensure performance, reliability, and long-term durability.
Why is package cleaning important in semiconductor assembly?
Cleaning packages eliminates ionic and organic contaminants that can cause corrosion, electrical leakage, or delamination, thereby improving device yield and operational stability.
What types of contaminants are typically removed during package cleaning?
Contaminants include solder flux residues, mold release agents, particulates from assembly, and oils from handling or processing equipment.
Which cleaning methods are used for package cleaning?
Methods include aqueous cleaning, solvent-based cleaning, ultrasonic agitation, and vapor degreasing, often optimized for delicate semiconductor materials and package geometries.
Can package cleaning affect package integrity?
When performed using compatible chemistries and controlled conditions, package cleaning preserves mechanical and chemical integrity, avoiding damage to sensitive components and encapsulants.
Are there special cleaning chemicals for semiconductor packages?
Yes. INVENTEC provides advanced cleaning solutions formulated to remove tough residues without harming package materials, ensuring compliance with environmental and industry standards.
How is cleaning effectiveness verified in package cleaning?
Techniques include ionic contamination analysis, surface inspections, and electrical testing to confirm the removal of residues and absence of defects.
Is package cleaning necessary for all semiconductor packaging types?
While some no-clean processes may not require cleaning, high-reliability applications such as automotive or aerospace often mandate package cleaning to ensure stringent quality standards.
What environmental considerations apply to package cleaning?
Cleaning agents must comply with low toxicity, biodegradability, and regulatory restrictions on VOCs and hazardous substances, aligning with sustainable manufacturing goals.
Does INVENTEC offer package cleaning solutions?
Yes, INVENTEC Performance Chemicals provides specialized cleaning chemistries designed for semiconductor package cleaning, supporting high-quality assembly and manufacturing processes.
Technical support
Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
- to select the right product based on your specific needs
- to assist you in your product qualification process
- to guide you with the initial set up of you process at all your worldwide manufacturing facilities
- to provide fast response on technical issues which could occur at any time during mass production.
Free-of-Charge cleaning trials
In order to know if our products reach your expectations on your specific part and according to your desired process, we provide FREE-OF-CHARGE cleaning trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. You want to attend the trials? We are happy to welcome you.