ECOREL FREE LT 140-18
Low temperature solder paste
- Sn42Bi57.6Ag0.4 lead free solder paste
- Low temperature SMT printing process
- Halogen free & low voiding
ECOREL FREE LT 140-18
A no clean solder paste combining the metallurgical properties and benefits of a low melting point alloy with high performance chemistry of the ECOREL™ range, assuring that the assembled electronics can reach their best reliability. A low reflow temperature is recommended for thermal sensitive components such as LEDs, MEMS, CMOS, plastics and flexible circuits.
Compared to low melting point alloy solder pastes like SnBi, ECOREL FREE LT 140-18 achieves better wetting and solder joint strength due to the presence of silver.
FEATURES
| SPECIFICATIONS | ECOREL FREE LT 140-18 |
|---|---|
| Alloy | Sn42Bi57.6Ag0.4 |
| Melting point (°C) | 139-140 |
| Powder size distribution (microns) / Type | 25–45 / Type 3 |
| Metal content (%) |
Printing: 89.5 – 90.5 Dispensing: 85.5 – 86.5 |
| Post reflow residues | Approximately 7% by w/w |
| Halogen content | No halogen |
| Viscosity* (Pa.s 20°C) *Brookfield RVT, TF at 5RPM |
Printing: 750 – 950 Dispensing: 400 – 500 |
CHARACTERISTICS
| STANDARDS TESTS | RESULTS | PROCEDURES |
|---|---|---|
| Flux Classification | ROL0 | ANSI/J-STD-004 |
| 113 | ISO 9454 | ISO 9454 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
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PERFORMANCE
- Excellent solder joint strenght and interconnection reliability
- Superior Wettability – reduced solderballing
- Low voiding
COST
- Reduced energy consumption
HSE
- Reduced CO2 emissions
- Halogen free
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.